Heller 1810 MK5 10 Zone SMT Reflow Oven for Lead Free Soldering of PCBs 2" 22" 5 56 cm Wide

Gen5 Waterless Cooling and Flux Separation System – Heated Cooling Module in 1st Cooling Zone for Controlling Cooling Slope – Enhanced Waterless Cooling Modules for Low Product Exit Temperature.

Complete Computer Control System including:

• Flat Panel Color Monitor & Keyboard Support Arm
• ECD CPK & SPC data and alarm logging with timed download or printout capability
• 5 Thermocouple “Real Time” profiling
• Complete KIC & ECD Profiling & Storage Software including the following features:
• Profile Storage/Overlay Software including the following features:
• Profile Graph Storage of up to 500 graphs
• Profile graph overlay of “benchmark” profile with current profile
• Profile graph phase shifting to align two graphs
• Moveable slope window providing average slope over given portion of graph
• 6 color graphics to distinguish between graphs

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