BPC-SX2

Model:	BPC-SX2
Category:	SPI / Solder Paste Inspection
Model Year:	2015
Condition:	used
Location:	China
Offered by:	Qinyi Electronics Co.,Ltd
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DJTECH SPI  BPC-SX2

Brand: DJTECH

Model: BPC-SX2

Type: 3D SPI

Circuit board size: 50*50mm-510*460m (standard)

Circuit board thickness: 0.3-4.Omm

Transport standard operation surface or inner surface can be (set at the time of shipment)

The conveying direction is from left to right or from right to left (set at the time of shipment)

Conveying height 900±25mm

Inspection items Less tin, more tin, overflow, shift of center of gravity, bridging, cross-sectional area, protrusion area, average height, peak height

Small adjacent distance 0.08m, the printing height difference of adjacent part is less than 50um

Small detected components, pin pitch 0.15mm CSP, 0402 components (unit: mm)

Processing capacity 7.000m/sec (standard)

System specifications

Camera resolution: 1.3 million CCD pixels, 24um resolution

Illumination 2D: 360-degree panoramic view 2-segment RGB/3D: linear lighting

The inspection program is made to directly transform from the gerber data

Power AC100V ± 10% 1.5kVA single phase (50/6CHz)

Compressed air 0.4~0.5Mpa10N1/min

Equipment size w1100*D1200*1550mm (not including signal light)

Weight about 400KG

Optional function

1,L=750mm (corresponding to segmentation inspection)

2, ID.2D barcode correspondence

3. Statistical analysis software SPC

4. Offline programming

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