Automatic Thermo-compression Bonding System FIREBIRD TCB Series

Model:	Automatic Thermo-compression Bonding System FIREBIRD TCB Series
Category:	Semiconductor & Solar
Model Year:	2021
Condition:	new
Location:	Guangdong, China
Offered by:	SHENZHEN TOPQUALITY INDUSTRY & EQUIPMENT LTD.,
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FIASMPT REBIRD TCB Series

Automatic Thermo-compression Bonding System

Dimensions	W x D x H
	1,560 x 3,030 x 2,560 mm

Features

• Flexible materials handling capability for Heterogeneous Integration in 2D, 2.5D and 3D format
  • Co-exist die input from both wafer and tape & reel
  • Field configurable for strip / singulated / wafer substrate
  • Ultra wide carrier handling for singulated substrate
  • Direct wafer and glass substrate handling with SlimFEM
• Reliable with solid installation bases
  • > 250 sets installation in mass production
• Innovative process
  • Inert environment enables Liquid Phase Contact (LPC) process for high productivity
  • Real-time active tip tilt