Fan-out NUCLEUS Series

Model:	Fan-out NUCLEUS Series
Category:	Semiconductor & Solar
Model Year:	2022
Condition:	new
Location:	China
Offered by:	SHENZHEN TOPQUALITY INDUSTRY & EQUIPMENT LTD.,
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NUCLEUS Series Multi-Purpose Precision Pick & Place Tool Dimensions W x D x H 1,460 x 2,300 x 2,100 mm Features Driver of Fan-out and embedded packaging with Supporting flip chip and direct die attach mode with local and global alignment, including flux dipping Capable of direct handling of bare wafer substrate, wafer on carrier or substrate on carrier Support high bond force and thermal process Multi-chip bonding capability with an automatic tool changing system Class 100 cleaning standard during bonding Other configurations catering to the market NUCLEUS XD with extra large die handling capability up to 70mm x 70mm NUCLEUS XLplus with extra large substrate handling capability up to 600mm x 670mm