Samsung Hanwha Decan S1 SMT Pick and Place Machine

Flexible Production

High PCB handling capacity in a medium speed bonder

510 x 510mm (standard) / 1500 x 460mm (option) - PCBs of 1,500mm(L) x 460mm(W) size can be produced

High Reliability

Stable mounting of microchips

Automatic calibration is performed during production to maintain consistent placement accuracy

Productivity

Best performance in its class

Expanding the range of component recognition by camera high pixelation, increasing the simultaneous pick-up rate and speed of shaped component placement

Easy Operation

Enhanced ease of use

Easy and shortened calibration time for large odd-shaped components Maintains Chip component lighting level unification function and common feeder pickup coordinates

▶Speed : 47,000 CPH  (Optimum)
▶Spindle/Gantry : 10 Spindles/1Gantry
▶Parts: 03015~55mm(H15),L75mm
▶Accuracy : ±28μm @ Cpk≥ 1.0/Chip
                   ±30μm @ Cpk≥ 1.0/IC
▶Max.PCB : L510xW510 (Standard)
            L1,500xW460 (Max)
▶Highest performance among chip Mounters of the same class
▶Places microchips stably
▶Increased convenience of operation

View Hanwha Decan S1 SMT Pick and P