Profiling for Successful BGA/CSP Rework
Published: |
August 14, 2013 |
Author: |
Metcal |
Abstract: |
This paper discusses how to successfully profile a printed circuit board when reworking Ball Grid Array and Chip Scale Packages.... |
|
|
|
|
|
|
You must be a Company Information:
- Jan 02, 2019 - Risk Mitigation in Hand Soldering
- Feb 22, 2018 - Hand Soldering with Lead Free Alloys
- Apr 23, 2015 - Rework Challenges for Smart Phones and Tablets
- Nov 27, 2012 - Effective Qualification of Soldering Iron Performance Criteria
- Nov 12, 2012 - Increase Your Process Control and Lower Cost of Ownership
- See all SMT / PCB technical articles from Metcal »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Profiling for Successful BGA/CSP Rework article has been viewed 1278 times
