Small Volume Solder Paste Dispensing for Aerospace and Defense
Published: |
September 7, 2023 |
Author: |
GPD Global, Inc. |
Abstract: |
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from GPD Global 
»
- Mar 19, 2024 - What is Underfill
- Sep 07, 2023 - Conductive Adhesive Dispensing for Electronic Manufacturing
- Aug 16, 2023 - Staking/Epoxy Adhesive Dispensing for Aerospace
- Aug 16, 2023 - Masking and Underfill Dispensing for Medical Device
- Aug 16, 2023 - Thermal Interface Material (TIM) Dispensing For Consumer Products
- See all SMT / PCB technical articles from GPD Global »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 18, 2023 - Revolutionize PCB Manufacturing with SMT Dispensing Machines | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Small Volume Solder Paste Dispensing for Aerospace and Defense article has been viewed 226 times
