Reactivity Of No-Clean Flux Residues Trapped Under Bottom Terminated Components
Published: |
July 20, 2017 |
Author: |
Bruno Tolla, Ph.D., Jennifer Allen, Kyle Loomis - Kester Corporation, Mike Bixenman, DBA - KYZEN Corporation |
Abstract: |
As electronic devices increase functionality in smaller form factors, there will be limitations, obstacles and challenges to overcome. Advances in component technology can create issues that may have time delayed effects. One such effect is device failure due to soldering residues trapped under bottom terminated components. If the residues trapped under the component termination are active and can be mobilized with moisture, there is the potential for ion mobilization causing current leakage.... |
|
|
|
|
|
|
You must be a Company Information:
- May 17, 2017 - How to Use the Right Flux for the Selective Soldering Application
- Dec 29, 2016 - Partially-Activated Flux Residue Impacts on Electronic Assembly Reliabilities
- Oct 23, 2012 - Lead-free SMT Soldering Defects How to Prevent Them
- Feb 13, 2009 - SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control
- Jan 15, 2009 - Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences
- See all SMT / PCB technical articles from Kester »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Reactivity Of No-Clean Flux Residues Trapped Under Bottom Terminated Components article has been viewed 1408 times
