MOS Scaling: Transistor Challenges for the 21st Century

Published:

May 7, 1999

Author:

Scott Thompson, Paul Packan, Mark Bohr

Abstract:

To enable transistor scaling into the 21st century, new solutions such as high dielectric constaConventional scaling of gate oxide thickness, source/drain extension (SDE), junction depths, and gate lengths have enabled MOS gate dimensions to be reduced from 10mm in the 1970’s to a present day size of 0.1mm. To enable transistor scaling into the 21st century, new solutions such as high dielectric constant materials for gate insulation and shallow, ultra low resistivity junctions need to be developed. In this paper, for the first time, key scaling limits are quantified for MOS transistorsnt materials for gate insulation and shallow, ultra low resistivity junctions need to be developed....

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Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

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