Challenges of CAD Development for Datapath Design

Published:

May 6, 1999

Author:

Tim Chan, Amit Chowdhary, Bharat Krishna, Artour Levin, Gary Meeker, Naresh Sehga

Abstract:

In many high-performance VLSI designs, including all recent Intel microprocessors, datapath is implemented in a bit-sliced structure to simultaneously manipulate multiple bits of data. The circuit and layout of such structures are largely kept the same for each bit slice to achieve maximal performance, higher designer productivity, and better layout density. There are very few tools available to automate the design of a general datapath structure, most of which is done manually......

  • Download Challenges of CAD Development for Datapath Design article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

  • Phone (408) 765-8080

See Company Website »

Company Postings:

(32) technical library articles

(5) news releases

  • Mar 19, 2024 - What is Underfill | GPD Global
  • Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Browse Technical Library »

Challenges of CAD Development for Datapath Design article has been viewed 499 times

Jade Series Selective Soldering Machines