Reliable Selective Soldering For High Volume Assemblies
Published: |
April 14, 2020 |
Author: |
Gerjan Diepstraten |
Abstract: |
The number of through hole connections on a circuit assembly are decreasing with the drive toward miniaturization. When these assemblies are manufactured in high volumes the most convenient method is selective soldering. Although selective soldering is very well introduced in automotive and industrial applications it can also be a very efficient method to solder high volume consumer products.... |
|
|
|
|
|
|
You must be a Company Information:
- May 07, 2023 - Electronic Assembly Misprint Cleaning Advancements
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers
- Jun 28, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers
- Apr 14, 2020 - Stencil Printing 008004/0201 Aperture Components
- Apr 14, 2020 - Selective Solder Fine Pitch Components On High Thermal Mass Assembly
- See all SMT / PCB technical articles from ITW EAE »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Reliable Selective Soldering For High Volume Assemblies article has been viewed 1048 times
