Projection Moiré vs. Shadow Moiré for Warpage Measurement and Failure Analysis of Advanced Packages
Published: |
January 31, 2013 |
Author: |
Joe Thomas |
Abstract: |
There are three key industry trends that are driving the need for temperature-dependent warpage measurement: the trend toward finer-pitch devices, the emergence of lead-free processing, and changes in device form factors. Warpage measurement has become a key measurement for analysis; prevention and prediction of interconnect defects and has been employed in failure analysis labs and production sites worldwide. First published in the 2012 IPC APEX EXPO technical conference proceedings... |
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