Technical Articles From IBL - Löttechnik GmbH

Today's Vapor Phase Soldering An Optimized Reflow Technology for Lead Free Soldering

Mar 20, 2014 | Dipl.-Ing. Helmut Leicht; Andreas Thumm - IBL-Löttechnik GmbH.

In the beginning of SMT, Vapor Phase Soldering was the preferred reflow soldering technology because of its excellent heat transfer capabilities. There were also some disadvantages like fast temperature rise, nearly no influence on the temperature profiles and high costs. So the use of Vapor Phase Soldering was reduced to special applications with high mass or complex boards in low numbers (e.g. for military or aerospace use)....

Going Lead Free With Vapor Phase Soldering - Lead Free Is Still a Challenge For Major Industries.

Jan 30, 2014 | Andreas Thumm

As of today, the electronic industry is aware of the requirements for their products to be lead free. All components are typically available in lead free quality. This comprises packages like BGAs with BGA solder balls to PCB board finishes like HASL. The suppliers are providing everything that is needed. It is harder to get the old tin leaded (SnPb) components for new applications today, than lead free ones.

So why has not everybody changed over fully yet and how can the challenges be overcome?

A big concern in this transition process is reflow soldering. The process temperatures for lead free applications became much higher. Related with this is more stress for all the components. It affects the quality and reliability of the electronic units and products......