Technical Articles From SMTnet
Read technical articles about electronics manufacturing added by SMTnet
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3 technical articles added by SMTnet
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Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies
Jan 03, 2021 | Ning-Cheng Lee
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate....
IPC Apex Expo 2020 Remarks
Mar 12, 2020 | Roland Girouard
IPC's APEX EXPO is always exciting & always fun and, most importantly, always beneficial to those who exhibit and attend. From technical conferences to standards committees to new and exciting things on the show floor - APEX 2020 was indeed a success...
Internet Marketing Article 01-24-2013
Jan 24, 2013 | Roland Girouard
Being found in the search engines for a wide variety of terms directly related to my business would be my 1st priority......