Electronics Manufacturing Technical Articles

XRF Technology In The Field - XRF Technology For Non-Scientists

Mar 21, 2022 | Thermo Fisher Scientific

X-ray fluorescence (XRF): a non-destructive analytical technique used to determine the chemical composition of materials XRF occurs when a fluorescent (or secondary) X-ray is emitted from a sample that is being excited by a primary X-ray source. Because this fluorescence is unique to the elemental composition of the sample, XRF is an excellent technology for qualitative and quantitative analysis of the material composition. XRF spectrometry has a broad range of applications in industry, which we will discuss later in this ebook....

Publisher: Thermo Fisher Scientific

Thermo Fisher Scientific

Thermo Fisher Scientific is an American provisioner of scientific instrumentation, reagents and consumables, and software and services to healthcare, life science, and other laboratories in academia, government, and industry.

Sunnyvale, California, USA

Other

Understanding Creep Corrosion Field Fails

Mar 16, 2022 | Phil Isaacs, Jing Zhang & Terry Munson

Dendrites, Electrochemical Migration (ECM) and parasitic leakage, are usually caused by process related contamination. For example, excess flux, poor handling, extraneous solder, fibers, to name a few. One does not normally relate these fails with environmental causes. However, creep corrosion is a mechanism by which electronic products fail in application, primarily related to sulfur pollution present in the air.1 The sulfur reacts with exposed silver, and to a lesser extent, exposed copper. This paper will explore various aspects of the creep corrosion chemical reaction...

Publisher: Foresite Inc.

Foresite Inc.

Foresite is a process consulting house and analytial laboratory dedicated to solving product reliability challenges for electronics manufacturers.

Kokomo, Indiana, USA

DfR Solutions (acquired by ANSYS Inc)

Creep Corrosion Of Electronic Assemblies In Harsh Environments

Mar 16, 2022 | Petri Savolainen and Randy Schueller

Creep corrosion occurs in electronics assemblies and it is reminiscent to electromigration but does not require electrical field to drive the reaction. Corrosive elements and moisture must be present for creep corrosion to occur. Sulfur is the most prominent element to cause creep corrosion in environments such as paper mills, rubber manufacturing, mining, cement manufacturing, waste water treatment etc., also including companies and locations nearby such industries. The main part of printed circuit board assembly (PCBA) to be affected is the PCB surface finish. Especially immersion silver is prone to creep corrosion, but it sometimes occurs in NiPd (lead frames), and to a lesser extent in ENIG and OSP surface finishes. As the use of immersion silver is increasing as PCB surface finish and electronics are more and more used in harsh environments, creep corrosion is a growing risk. In this paper we will present the driving forces and mechanisms as well as suitable tests and mitigation strategies against creep corrosion...

Publisher: DfR Solutions (acquired by ANSYS Inc)

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting

College Park,

Creep Corrosion On Lead-Free Printed Circuit Boards In High Sulfur Environments

Mar 16, 2022 | Randy Schueller

The material and process changes required to eliminate lead from electronics as required by Restriction of Hazardous Substance (RoHS) legislation was likely to result in new quality and reliability issues. The industry had over 50 years experience with tin-lead solders. Changing to different solder alloys, fluxes, termination plating materials, PCB surface finishes and soldering temperatures in a span of 1-2 years was a high risk undertaking. Although many potential issues were uncovered and resolved, one new failure mechanism was not foreseen by the industry. Immersion silver (ImAg) was widely adopted to replace hot air solder level (HASL) as the surface finish on PCBs. ImAg was known to tarnish when exposed to sulfur, but it was a surprise to find that it suffers extensive creep corrosion when the sulfur and humidity levels are high enough. Failures can occur in as little as a few weeks in industries such as rubber manufacturing, water treatment, paper mills or fertilizer production, among others. This paper uncovers the root cause of the creep corrosion mechanism and shows how to eliminate it. Corrosive environments were measured and the results of field testing of various surface finishes in these environments is shared. Also presented are some more effective corrosion test methods currently under development....

Publisher: Dell Inc

Dell Inc

Dell is an American company that develops, sells, repairs, and supports computers and related products and services, and is owned by its parent company of Dell Technologies.

Round Rock, Texas, USA

A Wearable Medical Sensor for Provisional Healthcare

Mar 09, 2022 | Amir Javadpour and HamidrezaMemarzadeh-Tehran

This paper presents the design and realization of a context-aware wireless health monitoring system for recording the heartbeat (HR) and respiration (RR) rate based on an indirect measurement approach. The system consists of a contact-less medical sensor as well as a communication infrastructure for handling the transmission and reception of the measured results. The contact-less sensor includes a highly sensitive tri-axial accelerometer, an accurate temperature and air pressure sensor that enable one to inspect patients' health condition by continuously monitoring of two critical signs related to the cardiorespiratory system....

Publisher: University of Tehran

University of Tehran

The University of Tehran is the oldest modern university located in Tehran, Iran. Based on its historical, socio-cultural, and political pedigree, as well as its research and teaching profile, UT has been nicknamed "The Mother Uni

Tehran, Iran

Utilising Commercially Fabricated Printed Circuit Boards as an Electrochemical Biosensing Platform

Mar 09, 2022 | Uroš Zupancic, Joshua Rainbow , Pedro Estrela and Despina Moschou

Printed circuit boards (PCBs) offer a promising platform for the development of electronicsassisted biomedical diagnostic sensors and microsystems. The long-standing industrial basis offers distinctive advantages for cost-effective, reproducible, and easily integrated sample-in-answer-out diagnostic microsystems. Nonetheless, the commercial techniques used in the fabrication of PCBs produce various contaminants potentially degrading severely their stability and repeatability in electrochemical sensing applications. Herein, we analyse for the first time such critical technological considerations, allowing the exploitation of commercial PCB platforms as reliable electrochemical sensing platforms....

Publisher: University of Bath

University of Bath

The University of Bath is a public research university located in Bath, Somerset, United Kingdom. It received its royal charter in 1966, along with a number of other institutions following the Robbins Report.

Bath, United Kingdom

Korea Research Institute of Bioscience and Biotechnology

Evolution of Wearable Devices with Real-Time Disease Monitoring for Personalized Healthcare

Mar 09, 2022 | Kyeonghye Guk, Gaon Han, Jaewoo Lim, Keunwon Jeong, Taejoon Kang, Eun-Kyung Lim, and Juyeon Jung

Wearable devices are becoming widespread in a wide range of applications, from healthcare to biomedical monitoring systems, which enable continuous measurement of critical biomarkers for medical diagnostics, physiological health monitoring and evaluation. Especially as the elderly population grows globally, various chronic and acute diseases become increasingly important, and the medical industry is changing dramatically due to the need for point-of-care (POC) diagnosis and real-time monitoring of long-term health conditions....

Publisher: Korea Research Institute of Bioscience and Biotechnology

Korea Research Institute of Bioscience and Biotechnology is a government research institute in Daejeon, South Korea.

Daejeon, South Korea

Università Campus Bio-Medico di Roma

Smart Sensors for Healthcare and Medical Applications

Mar 09, 2022 | Domenico Formica and Emiliano Schena

This special issue on "Smart Sensors for Healthcare and Medical Applications" focuses on new sensing technologies, measurement techniques, and their applications in medicine and healthcare. We proposed this topic, being aware of the pivotal role that smart sensors can play for the improvement of healthcare services in both acute and chronic conditions as well as for prevention towards a healthy life and active aging. In this editorial we shortly describe the potential of smart sensors in the aforementioned applications, before moving on providing a general overview of the 24 articles selected and published in this special issue....

Publisher: Università Campus Bio-Medico di Roma

Università Campus Bio-Medico di Roma is a for-profit college situated in Trigoria, founded in 1993 and promoted by the Beatus Alvaro del Portillo, according to the principles of the Catholic prelature of the Opus Dei.

Roma RM, Italy

Study on Medical Sensors

Mar 09, 2022 | Nadine Boudargham, Jacques Bou Abdo, Jacques Demerjian, and Christophe Guyeux

The advances in electronics allowed the development of smart miniature devices called medical sensors, that can collect physiological data from the human body and its surrounding and send it wirelessly to healthcare providers in order to help avoiding life threatening events. This article presents a general overview on the types of medical sensors, their properties, and the wireless technologies used to convey collected data. Also, this article is the first to provide a summary about the wearable sensors' brands available in the market, along with their interface and connection types....

Publisher: University of Notre Dame

University of Notre Dame

One of America's leading undergraduate teaching institutions, Notre Dame also has been at the forefront in research and scholarship. The aerodynamics of glider flight, the transmission of wireless messages, and research

Notre Dame, Indiana, USA

Rochester Electronics LLC

The Effects of Long-Term Storage on Solderability of Semiconductor Components

Mar 02, 2022 | Rochester Electronics LLC

In today's consumer-driven electronic marketplace many products have a limited useful life and component suppliers are moving to shorter product lifecycles. However, there are several industries that require semiconductor components to have a much longer lifecycle. In many cases application lifecycles within the Industrial, Automotive, Medical, Aerospace and Defense sectors may extend up to 30 years or more. As a result, an ongoing component supply becomes critical to sustaining these applications throughout their useful lifecycle. For this reason, it is often a requirement that semiconductor components be stored for extended periods of time after production ends....

Publisher: Rochester Electronics LLC

Rochester Electronics is the world's largest continuous source of semiconductors–100% Authorized by over 70 leading semiconductor manufacturers. As an original manufacturer stocking distributor, Rochester has over 15 billion ...

Newburyport, Massachusetts, USA

Other

Effects Of Storage Environments On The Solderability Of Nickel Palladium- Gold Finish With Pb-Based And Pb- Free Solders

Mar 02, 2022 | Edwin Lopez, Paul Vianco, Samuel Lucero, and Carly George

The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments: (1) 33.6, 67.2, or 336 hours in the Battelle Class 2 flowing gas environment or (2) 5, 16, or 24 hours of steam aging (88ºC, 90%RH)....

Publisher: Sandia National Laboratories

Sandia National Laboratories

For more than 60 years, Sandia has delivered essential science and technology to resolve the nation's most challenging security issues.

Albuquerque, New Mexico, USA

Other

Solderability after Long-Term Storage

Mar 02, 2022 | Joelle Arnold, Cheryl Tulkoff and Greg Caswell

The effect of long-term storage on manufacturability and reliability is an area of major concern for companies that attempt to proactively manage component availability and obsolescence. A number of issues can arise depending on the technology and storage environment. Mechanisms of concern can include solderability, stress driven diffusive voiding, kirkendahl voiding, and tin whiskering. Of all of these, solderability / wettability remains the number one challenge in longterm storage....

Publisher: DfR Solutions (acquired by ANSYS Inc)

DfR Solutions (acquired by ANSYS Inc)

College Park,

Considerations for Minimizing Radiation Doses to Components during X-ray Inspection

Feb 21, 2022 | David Bernard, Richard C. Blish, II

The ability to undertake non-destructive testing on semiconductor devices, during both their manufacture and their subsequent use in printed circuit boards (PCBs), has become ever more important for checking product quality without compromising productivity. The use of x-ray inspection not only provides a potentially non-destructive test but also allows investigation within optically hidden areas, such as the wire bonding within packages and the quality of post solder reflow of area array devices (e.g. BGAs, CSPs and flip chips)....

Publisher: Nordson DAGE

Nordson DAGE

The leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond tester technology.

Aylesbury. Buckinghamshire,

Inventec Performance Chemicals

Cleaning PCBs in Electronics: Understanding Today's Needs

Feb 16, 2022 | P.J.Duchi, Anne-Marie Laügt, Marie Verdier, G.Abidh

Because of the phase-out of CFCs and HCFCs, standard solder pastes and fluxes evolved from RA and RMA fluxes to No-Clean, to low residue No-Clean, to very low residue No-Clean. Many companies came out with their cleaning solutions, aqueous and semi-aqueous, with each product release being more innovative than the previous one. Unfortunately for most of the suppliers of cleaners, two other trends appeared; lead-free soldering and the progressive miniaturization of electronic devices...

Publisher: Inventec Performance Chemicals

Innovative Soldering, Cleaning & Coating materials for high-tech industries. Matching performance with sustainability.

Bry-sur-Marne, France

Georgia Institute of Technology

Additively Manufactured mm-Wave Multichip Modules With Fully Printed "Smart" Encapsulation Structures

Feb 09, 2022 | Xuanke He, Bijan K. Tehrani, Ryan Bahr, Wenjing Su, and Manos M. Tentzeris

This article presents the first time that an millimeter-wave (mm-wave) multichip module (MCM) with on-demand "smart" encapsulation has been fabricated utilizing additive manufacturing technologies. RF and dc interconnects were fabricated using inkjet printing, while the encapsulation was realized using 3-D printing. Inkjet-printed interconnects feature superior RF performance, better mechanical reliability, and on-demand, low-cost fabrication process....

Publisher: Georgia Institute of Technology

Center for Board Assembly Research CBAR- advanced research on board assembly processes and systems

Atlanta, Georgia, USA

Open Radio Unit White Box 5G

Jan 28, 2022 | Whizz Systems

This white paper provides an overview of the design and development process for the various hardware components that make up the 5G ORU white box. Whizz Systems is responsible for the electrical, thermal, mechanical engineering, and manufacturing aspects, as well as system validation and bring up of the turn key white box ORU solution....

Publisher: Whizz Systems

Whizz Systems

Electronic manufacturing services - electronic design, development and manufacturing. Circuit board design, prototyping, FPGA services, signal integrity and simulation, pcb assembly. Factories in California USA and Malaysia.

Santa Clara, California, USA

An Experimental Investigation of Fracture Toughness and Volume Resistivity of Symmetric Laminated Epoxy/ Glass Fiber/CNT multiscale composites

Jan 26, 2022 | Mahadevan Lakshmanan Karingamanna Jayanarayanan, Joyal Joesph

In this work an attempt is made to improve the fracture toughness and electrical conductivity of epoxy/glass fiber based laminates by the inclusion of carbon nanotube (CNT) fillers. The fiber orientation of the epoxy/ glass fiber (GF) fabric laminates was optimized based on estimation of mechanical properties. The carboxylic acid functionalized CNTs were incorporated into epoxy matrix by ultra-sonication method. The nano filled epoxy resin was used to prepare laminates with 30/45 GF fabric orientation. The CNT content was varied and its effect on the tensile properties was determined. The fracture toughness of multiphase composites was estimated using single edge notch bend (SENB) test. The presence of CNTs improved the fracture toughness by a crack bridging mechanism. The volume resistivity of multiphase composites was found to be superior to the conventional epoxy/CNT composite. The presence of glass fabric reduces the number of inter-tube contacts contributing to the reduction in volume resistivity....

Publisher: Amrita University

Amrita University

Amrita Vishwa Vidyapeetham is a multi-campus, multi-disciplinary research academia that is accredited 'A++' by NAAC and is ranked as one of the best research institutions in India.

Tamil Nadu, India

CALCE Center for Advanced Life Cycle Engineering

Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth

Jan 26, 2022 | Kenny Mahan, Yong Sun, Bongtae Han1, Sungwon Han, Mike Osterman

Reliability of conformal coatings used to mitigate tin whisker growth depends on their ability to contain tin whiskers. Two key material properties required to assess the reliability of a polyurethane coating are documented experimentally: adhesion strength and puncture strength. A modified blister test using a predefined blister area is employed to assess the adhesion strength and a puncture test is employed to evaluate the puncture strength of the coating. After measuring the properties at time zero, the coatings are subjected to accelerated testing conditions (high temperature/humidity storage and temperature cycling) and the degradations of the coating properties are documented....

Publisher: CALCE Center for Advanced Life Cycle Engineering

The largest electronic products research center focused on electronics reliability, is dedicated to providing a knowledge and resource base to support the development of competitive electronic components, products and systems.

College Park, Maryland, USA

Consultant / Service Provider, Training Provider

An Electrochemical Sensor for Determination of Sulfite (SO32-) in Water Based on Molybdenum Disulfide Flakes/Nafion Modified Electrode

Jan 19, 2022 | Jie Yang, Xiangyu Xu, Xuyan Mao, Liang Jiang, Xueliang Wang

The assay for monitoring the content of sulfite ions (SO32−) is essentially important because sulfite has some seriously toxic effects on both environment and human health. For this, a SO32- electrochemical sensor was fabricated utilizing molybdenum disulfide (MoS2) and Nafion. The cyclic voltammetry (CV) and differential pulse voltammetry (DPV) showed that MoS2 had excellently catalytical activity for the redox of SO32-....

Publisher: Jining Medical University

Jining Medical University

Jining Medical University, is a public institution of higher learning in Jining and Rizhao, Shandong province, China

Jining City, Shandong Province, China

Non‑Invasive Monitoring Of Ph And Oxygen Using Miniaturized Electrochemical Sensors In An Animal Model Of Acute Hypoxia

Jan 19, 2022 | Laura Pla, Sergio Berdún, Mònica Mir, Lourders Rivas, Sandrine Miserere, Samuel Dulay, Josep Samitier, Elisenda Eixarch, Miriam Illa, and Eduard Gratacós

pH and oxygen electrochemical sensors were evaluated in a ventilatory hypoxia rabbit model. The ventilator hypoxia protocol included 3 differential phases: basal (100% FiO2), the hypoxia-acidosis period (10% FiO2) and recovery (100% FiO2). Sensors were tested in blood tissue (ex vivo sensing) and in muscular tissue (in vivo sensing). pH electrochemical and oxygen sensors were evaluated on the day of insertion (short-term evaluation) and pH electrochemical sensors were also tested after 5 days of insertion (long-term evaluation). pH and oxygen sensing were registered throughout the ventilatory hypoxia protocol (basal, hypoxia-acidosis, and recovery) and were compared with blood gas metabolites results from carotid artery catheterization (obtained with the EPOC blood analyzer)....

Publisher: Universitat de Barcelona

Universitat de Barcelona

University of Barcelona is a public university located in the city of Barcelona, Catalonia in Spain. With 63,000 students, it is one of the biggest universities in Spain. It is one of the oldest universities in Catalonia, establis

Barcelona, Spain

Electrochemical Sensors

Jan 19, 2022 | Neelansh Sharma, Vishal Mutreja, Hardeep Kaur

Electrochemical sensors are a class of sensors in which the transducer component is the electrode. These methods are presently utilized in a wide assortment of business applications. These sensors are significant for some factors: the utilization of the electron for signal obtaining, which is known to be a perfect model for logical applications, without squander age; scaling down in versatile gadgets (test microvolume investigation); quick examination; and minimal effort of creation, permitting these techniques to be promoted (for example as business glucose sensors)....

Publisher: Chandigarh University

Chandigarh University

Chandigarh University, Punjab [CU] is the Best University in Punjab and North India that offers various Undergraduate and Post graduate Courses

Punjab, India

Publisher: Swiss Federal Institute of Technology Lausanne - Integrated Systems Laboratory (Laboratoire des Systèmes Intégrés – LSI)

A Flexible Front-End for Wearable Electrochemical Sensing

Jan 19, 2022 | Ivan Ny Hanitra, Lucia Lobello, Francesca Stradolini, Abuduwaili Tuoheti, Francesca Criscuolo, Tugba Kilic, Danilo Demarchi, Sandro Carrara and Giovanni De Micheli

This work presents the design and the realization of a flexible front-end circuitry for electrochemical sensing with wearable devices. The hardware combines readout circuitry for amperometric and Open Circuit Potential (OCP) measurements. The sensing platforms are dedicated to lactate and lithium detection in sweat, hence allowing the monitoring of athletes under physical effort....

Swiss Federal Institute of Technology Lausanne - Integrated Systems Laboratory (Laboratoire des Systèmes Intégrés – LSI)

LSI studies design technologies for circuits and systems. The objective is to research the interplay of hardware and software design for traditional (computation on silicon) and non-traditional (nanotechnology and biosensors)

Lausanne, Switzerland

Global LiDAR Sensors Market Growth to Gain Traction by a CAGR of ~12%

Jan 18, 2022 | Ataurrahaman

Research Nester published a report titled "LiDAR Sensors Market: Global Demand Analysis & Opportunity Outlook 2031" which delivers detailed overview of theglobalLiDAR sensors market in terms of market segmentation by type, technology, application, and by region....

Publisher: Research Nester

Research Nester is a one-stop service provider, leading in strategic market research and consulting with an unbiased and unparalleled approach towards helping global industrial players.

New York, New York, USA

Veermata Jijabai Technological Institute

Using Blockchain in Autonomous Vehicles

Jan 12, 2022 | Nidhee Kamble, Ritu Gala, Revathi Vijayaraghavan, Eshita Shukla, Dhiren Patel

Autonomous vehicles have the potential to revolutionize the automotive industry and are gaining immense attention from academia as well as industry. However, facets of autonomous vehicle systems related to the interconnection of independent components pose vulnerabilities to the system as a whole. These vulnerabilities aren't guaranteed to be solved by traditional security methods. Blockchain technology is a powerful tool that can aid in improving trust and reliability in such systems....

Publisher: Veermata Jijabai Technological Institute

VJTI Mumbai has pioneered India's Engineering education, research and training ecosystem. Pre-independence, VJTI had been instrumental in driving industrial growth throughout united India.

Mumbai, Maharashtra, India

National University of Singapore

Governing Autonomous Vehicles: Emerging Responses For Safety, Liability, Privacy, Cybersecurity, And Industry Risks

Jan 12, 2022 | Araz Taeihagh and Hazel Si Min Lim

The benefits of autonomous vehicles (AVs) are widely acknowledged, but there are concerns about the extent of these benefits and AV risks and unintended consequences. In this article, we first examine AVs and different categories of the technological risks associated with them. We then explore strategies that can be adopted to address these risks, and explore emerging responses by governments for addressing AV risks....

Publisher: National University of Singapore

The National University of Singapore is a national research university based in Singapore. Founded in 1905 as the Straits Settlements and Federated Malay States Government Medical School, NUS is the oldest autonomous university...

Singapore, Singapore

Association for the Advancement of Artificial Intelligence

Coordinating Hundreds of Cooperative, Autonomous Vehicles in Warehouses

Jan 12, 2022 | Peter R. Wurman, Raffaello D'Andrea, and Mick Mountz

Occasionally, mature industries are turned upside down by innovations. The years of research on robotics and multiagent systems are coming together to provide just such a disruption to the material-handling industry. While autonomous guided vehicles (AGVs) have been used to move material within warehouses since the 1950s, they have been used primarily to transport very large, very heavy objects like rolls of uncut paper or engine blocks....

Publisher: Association for the Advancement of Artificial Intelligence

The Association for the Advancement of Artificial Intelligence is an international scientific society devoted to promote research in, and responsible use of, artificial intelligence.

Palo Alto, California, USA

Association / Non-Profit

Printed Circuit Board Recycling: Physicochemical And Economic Analysis Of Metals

Jan 05, 2022 | Marcos Paulo Kohler Caldas, Monica Maria Jiménez Correa, Flávia Paulucci Cianga Silvas, Viviane Tavares de Moraes, Jorge Alberto Soares Tenório, Denise Crocce Romano Espinosa

This study aims to present the characterization of five different types of printed circuit boards (PCBs) for use in future recycling processes. PCBs used: motherboards, lead free motherboards, video cards, memory and printer cards. The comminution of the circuit boards was performed using blade mills and hammer mills with 9mm and 6mm meshes, respectively. Throughout the physical processing, analysis was made with stereoscopic optics to ensure that the correct materials had been released. The pre-magnetic separation parts were given a granulometric classification followed by acid digestion and loss on ignition tests....

Publisher: Universidade de São Paulo

Universidade de São Paulo

University of São Paulo is a public university in the Brazilian state of São Paulo. It ihe largest Brazilian public university and the country's most prestigious educational institution, the best university in Ibero-America,

São Paulo - State of São Paulo, Brazil

Recycling of Non-metallic Residue from Waste Printed Circuit Boards to Produce Interlocking Concrete Blocks

Jan 05, 2022 | Sawitri Pianchaiyaphum, Suphaphat Kwonpongsagoon, Premrudee Kanchanapiya, and Chakrapan Tuakta

The process of copper recovery from waste printed circuit board has generated large amounts of non-metallic fraction (NMF) residue. In this research, the residue was recycled as a substitute for fine aggregates at 0%, 5%, 10%, 15%, and 20% to produce interlocking concrete blocks. Properties of the interlocking concrete blocks produced in this study, such as density, water absorption, compressive strength, were firstly examined and the selected mixes were further evaluated for the heavy metal leachability....

Publisher: Mahidol University

Mahidol University

Mahidol University (Mahidol), an autonomous research institution in Thailand, had its origin in the establishment of Siriraj Hospital in 1888. Mahidol had an acceptance rate for Medicine of 0.4% as of the 2016 academic year.

Salaya, Nakhon Pathom, Thailand

Assessment of Pre-Treatment Techniques for Coarse Printed Circuit Boards (PCBs) Recycling

Jan 05, 2022 | Kai Dean Kang, I. M. Saman K. Ilankoon, Nimila Dushyantha and Meng Nan Chong

Waste electrical and electronic equipment or e-waste generation has been skyrocketing over the last decades. This poses waste management and value recovery challenges, especially in developing countries. Printed circuit boards (PCBs) are mainly employed in value recovery operations. Despite the high energy costs of generating crushed and milled particles of the order of several microns, those are employed in conventional hydrometallurgical techniques. Coarse PCB pieces (of order a few centimetres) based value recovery operations are not reported at the industrial scale as the complexities of the internal structure of PCBs limit efficient metal and non-metal separation....

Publisher: Monash University

Monash University

Monash University Malaysia, the Malaysian campus of Monash University opened in 1998 and is located within the Bandar Sunway township in Malaysia. It is the first foreign university in Malaysia.

Selangor, Malaysia

Recycling Waste Circuit Board Efficiently and Environmentally Friendly through Small-Molecule Assisted Dissolution

Jan 05, 2022 | Zhiqiang Chen, Meng Yang, Qian Shi, Xiao Kuang, H. Jerry Qi & Tiejun Wang

With the increasing amount of electronic waste (e-waste) generated globally, it is an enormous challenge to recycle printed circuit boards (PCBs) efficiently and environmentally friendly. However, conventional recycling technologies have low efficiency and require tough treatment such as high temperature (>200 °C) and high pressure. In this paper, a small-molecule assisted approach based on dynamic reaction was proposed to dissolve thermosetting polymers containing ester groups and recycle electronic components from PCBs....

Publisher: Xian Jiaotong University

Xian Jiaotong University

Xi'an Jiaotong University is a C9 League university with strengths in engineering, technology, management, and life sciences located in Xi'an, Shaanxi, China. It is a Chinese Ministry of Education Class A Double First Class Univ.

Xi'an, Shaanxi, China

Guangzhou Daheng Automation Equipment Co.,LTD

why need Under vaccum potting machine for motor stator iginition coil

Dec 31, 2021 | Fully Automatic Vacuum Chamber Glue Potting Solution

Any air entrapment in the potting compound can result in air bubbles that may cause performance problems in the finished component. Potting under vacuum is therefore frequently required to prevent air entrapment, especially with the increasingly small and complex assemblies required in today's electronics...

Publisher: Guangzhou Daheng Automation Equipment Co.,LTD

Whatsapp 0086 134 2516 4065 SMT glue dispenser machine, Meter mix dispenser, two component glue potting machine, mixi and dosing machine widely used PCB potting , led light encapsolution.

Guangzhou, China

Guangzhou Daheng Automation Equipment Co.,LTD

why need Under vaccum potting machine for motor stator iginition coil

Dec 31, 2021 | Fully Automatic Vacuum Chamber Glue Potting Solution

Publisher: Guangzhou Daheng Automation Equipment Co.,LTD

Whatsapp 0086 134 2516 4065 SMT glue dispenser machine, Meter mix dispenser, two component glue potting machine, mixi and dosing machine widely used PCB potting , led light encapsolution.

Guangzhou, China

Shenzhen Sewate Technology Co.,Ltd

What are the packaging forms of electronic components

Dec 31, 2021 | James Tong

The packaging method of surface mount components has become an important part of the SMT system. It directly affects the efficiency of assembly production and must be optimized in combination with the type and number of feeders of the SMT machine. There are four main types of packaging for surface mount components, Tape, tube, tray and bulk....

Publisher: Shenzhen Sewate Technology Co.,Ltd

Sewate professionally produce ESD protective packaging systems such as ic shipping tubes, plastic anti static ic tubes,, carrier tape, cover tape and reel, ESD trays for electronic components.

Shenzhen, China

How to Control Speed of Servo Motor & Anti-Interference Measures

Dec 31, 2021 | markee

A servomotor refers to the actuator to control the operation of mechanical components in the servo system and is a subsidy motor indirect transmission device. The servo motor can control speed, whose position accuracy is high, and convert voltage signal into torque and speed to drive the controlled object. A servomotor speed is controlled by the input signal, responding quickly....

OKmarts is an authorized and one-stop online mall for industrial parts covering refrigeration compressors, servo drives, servo motors, amplifiers, VFDs, HMIs, PLCs, encoders, sensors and more!

Hartford, Connecticut, USA

Czech Technical University in Prague

Effect of Thermal Aging on Solderabilityof ENEPIG Surface Finish Used in Printed Circuit Boards

Dec 29, 2021 | MaanBajnaid, Emily Holtzhouser, Jordan Terrell, Lawrence Yeh

Medtronic seeks to quantify the thermal aging limits of electroless Ni-electroless Pd-immersion Au (ENEPIG) surface finishes to determine how aggressive the silicon burn-in process can be without loss of solderability. Silicon burn-in (power testing at elevated temperature) is used to eliminate early field failures, critical for device reliability. Thermal aging due to burn-in or annealing causes Ni and Pd diffusion to and oxidation on the surface. Surface oxides limit wetting of the PbSn solder, affecting electrical connectivity of components soldered afterburn-in. Isothermal aging of two ENEPIG surface finishes was performed at 75°C-150°C for 100 hrs-1500hrs to test the thermal aging limits and identify how loss of solderability occurs....

Publisher: Purdue University

Purdue University

An educational institution, Purdue's ECET Department teaches ECAD design, electronic manufacturing, and electronic test including DFT.

West Lafayette, Indiana, USA

Investigation of Impacts on Printed Circuit Board Laminated Composites Caused by Surface Finish Application

Dec 29, 2021 | Denis Froš , Karel Dušek and Petr Veselý

The purpose of this study was to compare the strength of the bond between resin and glass cloth for various composites (laminates) and its dependence on utilized soldering pad surface finishes. Moreover, the impact of surface finish application on the thermomechanical properties of the composites was evaluated. Three different laminates with various thermal endurances were included in the study. Soldering pads were covered with OSP and HASL surface finishes. The strength of the cohesion of the resin upper layer was examined utilizing a newly established method designed for pulling tests....

Publisher: Czech Technical University in Prague

The Czech Technical University in Prague (CTU) is one of the largest and oldest technical universities in Europe. According to Methodology 2017+, CTU occupies first place in the rankings for technical universities in the Czech Rep

Prague 6, Czech Republic

How to Communicate PLC to VFD

Dec 28, 2021 | markee

PLC (Programmable Logic Controller) and VFD (Variable Frequency Drive) play an important role in industrial production and technological development. They have been widely used in the field of industrial automation and mechanical automation. The control of the PLC and VFD is quite intelligent and automated, which brings great convenience to industrial production and life. The PLC and VFD will perform intelligent calculation, control and output according to the predetermined program. Today we will focus on how the PLC and the VFD communicate, and in what ways? First, let's take a look at their respective basic structures....

OKmarts is an authorized and one-stop online mall for industrial parts covering refrigeration compressors, servo drives, servo motors, amplifiers, VFDs, HMIs, PLCs, encoders, sensors and more!

Hartford, Connecticut, USA

Oncology Information System Market Is Expected To Register a Notable CAGR of ~7%

Dec 27, 2021 | Ataurrahaman

Research Nester published a report titled "Oncology Information System Market: Global Demand Analysis & Opportunity Outlook 2030" which delivers a detailed overview of the global oncology information system market in terms of market segmentation by product, software, end-user, and by region....

Publisher: Research Nester

Research Nester is a one-stop service provider, leading in strategic market research and consulting with an unbiased and unparalleled approach towards helping global industrial players.

New York, New York, USA

List of Problems and Solutions for Centrifugal Air Compressor

Dec 22, 2021 | markee

As a speed type air compressor, centrifugal compressor can generate air flow moving in radial direction. Centrifugal air compressors are used by a large number of companies today because of their high-pressure tightness. Therefore, common faults in the operation have become one of the most concerned issues for users. This article will discuss causes of centrifugal compressor failures and give corresponding maintenance measures. At the end, OKmarts has listed the problems and solutions in detail for your quick reference....

OKmarts is an authorized and one-stop online mall for industrial parts covering refrigeration compressors, servo drives, servo motors, amplifiers, VFDs, HMIs, PLCs, encoders, sensors and more!

Hartford, Connecticut, USA

Würth Elektronik GmbH & Co. KG

HDI Microvia Technology – Cost Aspects

Dec 21, 2021 | Stefan Keller

Points of discussion in "HDI Microvia Technology – Cost Aspects" are: - Reasons for the use of HDI technology - Printed circuit board (PCB) size - Number of layers - Stack-up and complexity - Other important cost influences -–Design rules -–Drilling costs -–Microvia filling...

Publisher: Würth Elektronik GmbH & Co. KG

We produce circuit boards from your specifications in various designs.

Niedernhall, Germany

Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing

Dec 21, 2021 | Todd Young, Frank Polakovic and Michael Carano

High Density Interconnect (HDI) technologies are being used widely in Asia and Europe in consumer electronics for portable wireless communication and computing, digital imaging, and chip packaging. Although North America lags behind in developing process capability for this technology, HDI will become a significant business segment for North America. For this to happen, the printed circuit board shops will have to become process capable in fabricating fine lines and spaces, and also be capable in forming and plating microvias....

Publisher: Isola Group

Isola Group

Isola a global material sciences company focused on designing, developing, manufacturing and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer PCBs.

Chandler, Arizona, USA

CALCE Center for Advanced Life Cycle Engineering

Using Simulation to Optimize Microvia Placement and Materials to Avoid Failure During Reflow

Dec 21, 2021 | Dr. Kourosh Kalayeh, Dr. Nathan Blattau

This paper cover the following points: - Objective 01: Preprocessing, - Introduction, - Objective 02: Automated FE Scripting, - Objective 03: Postprocessing, Reliability Analysis of PTHs, - Objective 03: Postprocessing, Manufacturability of Microvias...

Publisher: CALCE Center for Advanced Life Cycle Engineering

College Park, Maryland, USA

Consultant / Service Provider, Training Provider

Reliability of PWB Microvias for High Density Package Assembly

Dec 21, 2021 | Reza Ghaffarian, Ph.D.

High density PWB (printed wiring board) with microvia technology is required for implementation of high density and high I/O area array packages (AAP). COTS (commercial off-the-shelf) AAP packaging technologies in high reliability versions with 1.27 mm pitch are now being considered for use in a number of NASA systems including the Space Shuttle and Mars Rovers. NASA functional system designs are requiring ever more denser AAP packages and board features, making board microvia technology very attractive for effectively routing a large number of package inputs/outputs....

Publisher: NASA Office Of Safety And Mission Assurance

NASA Office Of Safety And Mission Assurance

The Office of Safety and Mission Assurance (OSMA) assures the safety and enhances the success of all NASA activities through the development, implementation and oversight of agencywide safety, reliability, maintainability and ...

Washington, District of Columbia, USA

Global Building Automation Systems Market Is Estimated To Occupy a Large Amount Of Revenue By Recording a CAGR of ~11%

Dec 20, 2021 | Ataurrahaman

The global building automation systems market is estimated to occupy a large amount of revenue by recording a CAGR of ~11% during the forecast period, i.e., 2022–2030, owing to the growing need for proper energy management across the globe, and increasing emphasis on overcoming utility costs....

Publisher: Research Nester

Research Nester is a one-stop service provider, leading in strategic market research and consulting with an unbiased and unparalleled approach towards helping global industrial players.

New York, New York, USA

Global Recycled Plastics Market Is Growing With a CAGR of 4.5%

Dec 20, 2021 | Ataurrahaman

Research Nester, in its repository of market research reports, has added a report on the topic "Global Recycled Plastics Market", which is studied for the forecast period, i.e., 2021-2028. The report includes a brief analysis of the key players operating in the market, along with their latest developments. The report also focuses on the latest market trends, along with the opportunities and the drivers that are expected to drive the market growth during the forecast period....

Publisher: Research Nester

Research Nester is a one-stop service provider, leading in strategic market research and consulting with an unbiased and unparalleled approach towards helping global industrial players.

New York, New York, USA

Troubleshooting of Diffusion Silicon Pressure Transmitter

Dec 17, 2021 | markee

Diffusion silicon pressure transmitter is applied in a wide variety of industries, such as petroleum, chemical industry, steel, power, light industry and environmental protection industry. It can complete the work of measurement and control of the gauge pressure, negative pressure or absolute pressure of various fluid pressure. Most importantly, this type of transmitter can be used in corrosive medium and harsh or dangerous environment. In the process of using the transmitter, there may be some faults or problems....

OKmarts is an authorized and one-stop online mall for industrial parts covering refrigeration compressors, servo drives, servo motors, amplifiers, VFDs, HMIs, PLCs, encoders, sensors and more!

Hartford, Connecticut, USA

CALCE Center for Advanced Life Cycle Engineering

Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages under Torsion Loads

Dec 16, 2021 | Vikram Srinivas, Michael Osterman, Robert Farrell

Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensive and challenging task of routing high-speed memory lines from under the processor chip out to memory chip in separate packages. Instead, the memory sits on top of the processor and the connections are automatically made during assembly. For this reason PoP technology has gained wide acceptance in cell phones and other mobile applications. PoP technology can be assembled using one-pass and two-pass assembly processes. In the one-pass technique the processor is first mounted to the board, the memory is mounted to the processor and the finished board is then run through the reflow oven in a single pass. The two-pass technique has an intermediate step in which the memory is first mounted onto the processor....

Publisher: CALCE Center for Advanced Life Cycle Engineering

College Park, Maryland, USA

Consultant / Service Provider, Training Provider

Package-on-Package (PoP) Warpage Characteristic and Requirement

Dec 16, 2021 | Wei Keat Loh, Ron Kulterman, Tim Purdie, Haley Fu, Masahiro Tsuriya

Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging....

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA