Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

SMTnet
»
Technical Library

1757 SMT / PCB Assembly Related Technical Articles

Soldering of SMD Film Capacitors in Practical Lead Free Processes

Jun 02, 2009 | Matti Niskala, Product Manager; Evox Rifa Group Oyj, a KEMET Company.

Today the lead free soldering process is a must in commercial electronics and it is also coming more and more important in automative and industrial electronics sectors in the near future. The most common choices for lead free solders are different Tin-Solder-Copper (SAC) alloys. Processes using SAC solders cause extra stress, because of increased process temperatures, especially to the plastic materials....

Publisher: KEMET Electronics Corporation

KEMET Electronics Corporation

KEMET offers the world's most complete line of surface-mount and through-hole capacitor technologies across tantalum, ceramic, film, aluminum, electrolytic, and paper dielectrics.

Simpsonville,

New Precision Coating Deposition Method for Photovoltaic Manufacturing

May 28, 2009 | Stuart Erickson, President; Ultrasonic Systems, Inc.

Considerable effort is ongoing to improve the efficiency and to move towards high-volume manufacturing of photovoltaic cells. Much attention has been focused on developing in-line processes to replace the current batch processes. A critical process to improve the performance of solar wafers is the application of Dopants. The basic requirement for this process is an automated method for applying a very thin, uniform film of Dopant to the silicon wafer as part of an in-line manufacturing process....

Publisher: Ultrasonic Systems, Inc.

Ultrasonic Systems, Inc.

USI manufactures high-performance spray coating equipment based on patented, nozzle-less ultrasonic spray head technology.

Haverhill, Massachusetts, USA

Flexible Termination - Reliability in Stringent Environments

May 21, 2009 | John Prymak, Corey Antoniades, Peter Blais, Allen Hill, Ken Lai, Mark Laps, Kevin Lynn, Reggie Phillips, Corey Riedl, Axel Schmidt, Bill Sloka, Paul Staubli; KEMET Corporation.

Failure due to board flex cracks persists as the dominant failure mode in multi-layer ceramic capacitors (MLCC). (...) This paper is intended to show the impact of temperature cycling, high-temperature life tests, and multiple bend exposures to the MLCC with this flexible termination....

Publisher: KEMET Electronics Corporation

KEMET Electronics Corporation

KEMET offers the world's most complete line of surface-mount and through-hole capacitor technologies across tantalum, ceramic, film, aluminum, electrolytic, and paper dielectrics.

Simpsonville,

Tackling SMT Enemy Number One - Raising The Standard of Solder Paste Application

May 14, 2009 | MYDATA automation

Is screen printing technology able to keep pace with rising quality demands and increasingly complex board layouts? Or, is new jet printing technology ready to fill the gap? A comparison study between the two methods reveals some interesting differences. Screen printers offer some possibilities for optimizing solder paste deposits, but optimization is far easier and quicker with the jet printer. At the same time, the ability to print individualized deposits on every single pcb pad may be the ultimate answer to the growing quality challenge....

Publisher: Mycronic AB

Mycronic's High Flex division offers SMT equipment and solutions to high-mix electronics manufacturers with a requirement for quick changeover, high quality and high equipment utilization rate.

Täby, STOCKHOLM, Sweden

Solder Phase Coarsening, Fundamentals, Preparation, Measurement and Prediction

May 07, 2009 | Crina Rauta, Dr. Abhijit Dasgupta and Dr. Craig Hillman, DfR Solutions.

Thermal fatigue has been one of the most serious problems for solder joint reliability. Thermo-mechanical fatigue failure is considered to be closely related to micro-structural coarsening (grain/phase growth). Factors that influence the phase growth are studied and measurement methods are discussed, including the preparation of the eutectic solder sample for phase size measurement. Three categories of models used to predict grain growth in polycrystalline materials are presented. Finally, phase growth in solder during high temperature aging and temperature cycling and its use as a damage correlation factor are discussed....

Publisher: DfR Solutions (acquired by ANSYS Inc)

DfR Solutions (acquired by ANSYS Inc)

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting

College Park,

Consultant / Service Provider

Exposing the Myth: The Value of Branding in B2B Markets

Apr 30, 2009 | Protean Marketing Inc.

A brand is the most important strategic asset your business will ever possess. Yet ask even the most experienced marketer and they will struggle to communicate the concept in a single sentence. Furthermore, if you were to approach the majority of today's business-to-business organisations, they would probably tell you that branding finds little application in a market allegedly filled with dispassionate decision makers. However, an increasingly competitive market landscape is eroding this reality - if, indeed, it ever existed. B2B marketing must follow the example of its consumer-focused counterpart and embrace the notion that a strong brand has the power to differentiate, build and protect those it represents in the face of incessant commoditization....

Publisher: Protean Marketing Inc

Protean Marketing Inc

Protean Marketing is a specialist communications agency with offices in the USA and Europe. We help companies define, plan and execute marketing communications strategies that generate increased sales, revenue and market share.

Austin, Texas, USA

Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World

Apr 30, 2009 | Kevin Knadle.

This presentation surveys the most significant via and via-related laminate failure mechanisms from past to present using data from current induced thermal cycling (CITC) testing, failure analysis, and other sources. The relative life and failure modes of thru vias, buried vias, and microvias (stacked vs. non-stacked) are compared, along with the affect of structure, materials, and peak temperatures on the above. The origin of via-induced laminate failures such as "eyebrow cracks" and Pb free related internal delamination is also explored....

Publisher: i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

SMT Preventative Maintenance: Nozzles

Apr 23, 2009 | Zach Shook, Marketing Director; Count On Tools, Inc.

No SMT equipment can place accurately and run efficiently without quality nozzles and feeders. These two factors are the core of the pick and place process. If the machine is either unable to pick parts consistently or hold on to the components during the transport from feeder to PCB, defects will result. ...

Publisher: Count On Tools, Inc.

Count On Tools, Inc.

COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.

Gainesville, Georgia, USA

How to Profile a PCB

Apr 22, 2009 | P. John Shiloh, John Malboeuf.

An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process....

Publisher: DDM Novastar Inc

DDM Novastar Inc

Turnkey SMT assembly solutions, manual & automated stencil printers, manual & automatic pick & place systems with dispensers, wave solder & selective solder machines, lead free solder reflow ovens, component counters, & thru-hole

Ivyland, Pennsylvania, USA

Dealing with the Top Five Factory Floor Productivity Killers in the PCB Industry

Apr 16, 2009 | Dr. Henry Jurgens; Valor Division of Mentor Graphics Corp.

The worldwide electronics industry has sales of $750 billion, two thirds of which is accounted for by PCB assembly. PCB manufacturing is characterised by an obsessive drive for increased productivity in the context of three significant industry drivers: shorter product lifecycles, more complexity, outsourcing...

Publisher: Mentor Graphics

Mentor Graphics

A leader in software solutions for electroncs design, Mentor Graphics is the only EDA company with a total end-to-end solution for design though manufacturing.

Wilsonville, Oregon, USA

Consultant / Service Provider

If you bear the cost of your product's failure, shouldn't you have a say in ensuring it's success?

Apr 09, 2009 | ECD

Evidence has come to light that increased solder process temperatures, specifically for lead free solder, are dramatically shortening life expectancy of components; failures do not show up during initial test, but much later on in the products life, ...

Publisher: Electronic Controls Design Inc. (ECD)

Electronic Controls Design Inc. (ECD)

ECD is recognized worldwide for its leadership and expertise in thermal monitoring and analysis technology. The company is a pioneer in the design, development, and manufacturing of advanced thermal profiling systems and software.

Milwaukie, Oregon, USA

Consultant / Service Provider, Manufacturer

Economical Aluminum Substrates Make Light Work of Visible LED Circuits

Apr 09, 2009 | Tom Morris, Applications Engineering Manager; T.T. Electronics IRC Advanced Film Division.

Advances in solid state light emitting diodes (LEDs) over the last several years have opened new applications for these devices. Traditionally used only in low power, low light output applications, modern high power LEDs are finding their way into a wide variety of applications. LEDs for lighting applications offer several advantages over traditional incandescent lighting methods...

Publisher: IRC, Inc - Advanced Film Division of TT electronics, plc

IRC, Inc - Advanced Film Division of TT electronics, plc

IRC has been a leader in resistor technology, including the industry's comprehensive range of current sense resistors, precision discrete and networks, integrated passive components, and specialized power resistors.

Corpus Christi, Texas, USA

A Compliant and Creep Resistant SAC-Al(Ni) Alloy

Mar 27, 2009 | Dr. Benlih Huang, Dr. Hong-Sik Hwang, and Dr. Ning-Cheng Lee; Indium Corporation of America.

The Sn-Ag-Cu (SAC) alloys have been considered promising replacements for the lead-containing solders for the microelectronics applications. However, due to the rigidity of the SAC alloys, compared with the Pb-containing alloys, more failures have been found in the drop and high impact applications for the portable electronic devices, such as the personal data assistant (PDA), cellular phone, notebook computer..etc...

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Ten Steps Toward More Successful Projects

Mar 25, 2009 | Mike Weekes.

Have you ever been asked to lead a project to fix a problem, implement a new technology or some other initiative? It can be intimidating. Just because you, yourself are a good problem-solver, doesn't mean you have the capacity or drive to work with a team to achieve a goal. Often the secret to success lies in up-front preparation. Here are ten things you can do to help assure that when the project is done, it will have the effective results your leadership team is looking for....

Publisher: Whataboutquality LLC

Whataboutquality LLC

Whataboutquality provides a full spectrum of business process improvement solutions. We can solve a specific issue, help you map out your organization, it's key processs in order to find opportunities and solutions.

Osprey, Florida, USA

Consultant / Service Provider

A HDMI Design Guide For Successful High-Speed PCB Design

Mar 25, 2009 | Thomas Kugelstadt, Senior Systems Engineer; Texas Instruments Inc.

This article presents design guidelines for helping users of HDMI mux-repeaters to maximize the device's full performance through careful printed circuit board (PCB) design. We'll explain important concepts of some main aspects of high-speed PCB design with recommendations. This discussion will cover layer stack, differential traces, controlled impedance transmission lines, discontinuities, routing guidelines, reference planes, vias and decoupling capacitors....

Publisher: Texas Instruments

Texas Instruments

Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers real world signal processing requirements. In addition to Semiconductor, the company includes the Educational & Productivity Solutions business. T

Dallas, Texas, USA

How Clean Is Clean?

Mar 19, 2009 | Michael Konrad, President; Aqueous Technologies Corporation

Over the past several years, post-reflow defluxing of circuit assemblies has gained in popularity. Microminiaturization of components and boards, combined with higher expected reliability and increased product liability, have contributed to the prominence of defluxing. Lead-free solder paste - with its higher reflow temperatures and negative effects on flux - increase the likelihood of post-reflow defluxing to increase a product's reliability and aesthetic appearance....

Publisher: Aqueous Technologies Corporation

Aqueous Technologies Corporation

Manufacturer of automated defluxing/cleaning equipment, cleanliness testing equipment, and stencil cleaning equipment.

Corona, California, USA

Startling Results From Reliability Testing

Mar 13, 2009 | Lars Wallin, Project Manager Live Production Events at EP shows at the Stockholm Fair IPC European Representative.

Open product reliability testing in Stockholm, Sweden in January as part of a live production event generated some quite startling results. It was apparent that many components simply cannot handle the high reflow temperatures of a lead-free soldering process, and that many surface-mount machine suppliers are battling significant problems with QFN packages and other components that are mounting edgeways (bill boarding). However, some suppliers have achieved good results....

Publisher: Mycronic AB

Mycronic's High Flex division offers SMT equipment and solutions to high-mix electronics manufacturers with a requirement for quick changeover, high quality and high equipment utilization rate.

Täby, STOCKHOLM, Sweden

When It Comes to Cost Reduction, Variation and Waste are the Enemy

Mar 05, 2009 | Mike Weekes.

In a recent survey of 89 organizations conducted by Whataboutquality.com, respondents were asked what few key characteristics defined quality, in the eyes of their customer, the most popular response was: the product or service met my requirements. The next two most popular responses were: it worked like I expected and it was a good value, worth what I paid for it (...) So how do you continue to exceed customer expectations and simultaneously reduce costs? There are two paths to take. You can find and reduce the variation in your process and you can eliminate as much of the non-value-added waste in your operation....

Publisher: Whataboutquality LLC

Whataboutquality LLC

Whataboutquality provides a full spectrum of business process improvement solutions. We can solve a specific issue, help you map out your organization, it's key processs in order to find opportunities and solutions.

Osprey, Florida, USA

Consultant / Service Provider

Imbedded Component/Die Technology (IC/DT®)

Feb 26, 2009 | Mark McMeen.

STI has developed a patented1 packaging technology coined Imbedded Component/Die Technology (IC/DT®) to integrate multiple subsystems within an electronics assembly into a single, advanced, high-density assembly. Imbedded Component/Die Technology (IC/DT®) enables the manufacturing and assembly of smaller, lighter, and more technologically advanced high density CCAs through imbedding unpackaged components in a 3-D laminate substrate with integrated thermal management...

Publisher: STI Electronics

STI Electronics

Since 1982, STI Electronics, Inc. (STI) has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly in the electronics industry.

Madison, Alabama, USA

Consultant / Service Provider, Manufacturer, Standards Setting / Certification, Training Provider

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control

Feb 13, 2009 | Peter Biocca, Senior Engineer, Technical Manager; Kester ITW,

To meet the market demand for a best-in-class, low-cost leadfree alloy for wave, selective and dip soldering...

Publisher: Kester

Kester is a leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Coating Drug-eluting Arterial Stents Using Ultrasonic Spray Nozzles

Feb 04, 2009 | Harvey L. Berger

One proven method used to treat clogged arteries employs tubular, mesh-like metal structures, known as stents, inserted into an affected artery to relieve the blockage. Bare metal stents often cause a condition called restinosis, the buildup of scar tissue around the stent, causing re-blockage. To counter this, polymer coatings containing drugs that are released over time are used to inhibit restinosis. Applying coatings to stents, which have intricate geometries, is challenging. Using ultrasonic atomizing spray nozzles has proven effective in achieving continuous and uniform coatings. This paper describes the unique nozzle designs employed, the methodology used, and the results obtained....

Publisher: SONO-TEK CORPORATION

SONO-TEK CORPORATION

Manufacturer of precision ultrasonic spraying systems for a myriad of applications. Our patented technologies produce micron size uniform droplets, creating ultra thin layers onto any size or shape substrate.

Milton, New York, USA

Can You Afford Not To Improve in 2009?

Jan 29, 2009 | Michael Weekes.

Times are tough! Sales are down around the globe and it's getting more and more difficult to make a buck in the electronics industry. We all now have our cell phones and our big HD TV Screen at home so little of our materialistic world is unsatisfied. So how do we keep the doors open in 2009, let alone assure our future in the 21st Century?...

Publisher: Whataboutquality LLC

Whataboutquality LLC

Whataboutquality provides a full spectrum of business process improvement solutions. We can solve a specific issue, help you map out your organization, it's key processs in order to find opportunities and solutions.

Osprey, Florida, USA

Consultant / Service Provider

Hybrid Drying Technology for In-line Aqueous Cleaning of Lead-Free Assemblies

Jan 21, 2009 | Dirk Ellis

This paper describes a new approach to drying circuit board assemblies that significantly reduces the cost of ownership of an aqueous cleaning system. Drying performance is increased through a hybrid drying process that reduces energy input, exhaust requirements and sound levels. The combination of high temperature blow-off and convection brings the flexibility to tailor drying performance to fit the product's drying requirements....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Pushing the barriers of wafer level device integration: High-speed assembly, the case for MicroTape.

Jan 21, 2009 | Gordon Christison

Over the last 10 years, the adoption of wafer-level packaging (WLP) has expanded to a wide range of semiconductor devices applied in a crosssection of industries from Automotive to Mobile Phone, Sensors to Medical Technology....

Publisher: Siemens Process Industries and Drives

Siemens Process Industries and Drives

Siemens industrial manufacturing software, process automation, and automation and drives technology increases flexibility, cuts market launch lead time, and significantly reduces energy for manufacturing companies.

Alpharetta, Georgia, USA

Consultant / Service Provider, Manufacturer, Training Provider

Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences

Jan 15, 2009 | Peter Biocca, Senior Market Development Engineer, Kester.

Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice. SAC305 was endorsed by the IPC Solder Value Product Council in the United States as the preferred option for SMT assembly; most assemblers have transitioned to this alloy for their solder paste requirements. The SAC305 alloy due to its 3.0% content of silver is expensive when compared to traditional 63/37 for this reason many wave assemblers are opting for less costly options such as tin-copper based solders for their wave, selective and dip tinning operations....

Publisher: Kester

Kester is a leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Cleaning High-power Electronics

Jan 06, 2009 | Steve Stach, Austin America; Harald Wack, Ph.D., Naveen Ravindran, Zestron America; Joachim Becht, Zestron Europe

To prevent malfunctions in high-power electronics, flux residues must be removed from flip chip components prior to subsequent processes. As a result, integrating a suitable cleaning application into the manufacturing process of flip chip components is often required. Solvent based applications have re-emerged, and with that, an overall process solution is necessary....

Publisher: ZESTRON Americas

ZESTRON Americas

The globally leading provider of high precision cleaning products, services and training solutions in the electronics and semiconductor manufacturing industries.

Manassas, Virginia, USA

Consultant / Service Provider, Manufacturer, Training Provider

An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections

Jan 01, 2009 | Michael J. Rowlands and Vara Calmidi, Endicott Interconnect Technologiesogies

Recent technology advancement has enabled enhancement in PWB electrical performance and wiring density. These innovations have taken the form of improved materials, novel PWB interconnect structures, and manufacturing technology. One such advancement is Z-axis conductive interconnect. The Z-interconnect technology involves building mini-substrates of 2 or 3 layers each, then assembling several mini-substrates together using conductive paste....

Publisher: i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Five Myths of Reliability

Dec 23, 2008 | Dr. Nathan Blattau, Dr. Bob Esser, Dr. John McNulty, and James McLeish.

Myth 1: I don't worry about design, because most of my problems are with defects from suppliers......

Publisher: DfR Solutions (acquired by ANSYS Inc)

DfR Solutions (acquired by ANSYS Inc)

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting

College Park,

Consultant / Service Provider

Fuel Cell Production Revs Up. The Paste Printing Platform And Process Has Other Uses, Too.

Dec 18, 2008 | Clive Ashmore, Global Applied Process Engineering Manager; DEK.

Unless you've been living under a rock the past several years, you are no doubt keenly aware of the global drive toward alternative energy sources. Certainly this initiative is attractive because of the clear environmental benefits of developing fossil fuel substitutes, but also because of potential economic benefit. Although fuel cell technology has been proven viable for various applications, the production costs still remain relatively high, and further process development to promote low-cost, high-volume manufacturing is required to reach a price point that encourages widespread consumer acceptance....

Publisher: ASM Assembly Systems (DEK)

ASM Assembly Systems (DEK)

The ASM SMT Solutions segment is made up of SMT Printing Solutions (DEK) and SMT Placement Solutions (SIPLACE). Under the DEK brand, it sells best-in-class printing solutions for the electronics and solar industries.

Suwanee, Georgia, USA

Bromide-Free Options for Printed Circuit Boards

Dec 11, 2008 | Craig Hillman, PhD & Seth Binfield

Flame retardants have been around since the Egyptians and Romans used alum to reduce the flammability of wood. Brominated flame retardants (BFRs) first experienced use after World War II as the substitution of wood and metal for plastics and foams resulted in materials that were much more flammable. The widespread use of BFRs initiated in the 1970s with the explosion of electronics and electrical equipment and housings. For the US market, all of these products must conform to the UL 94 flammability testing specifications. In fact, the most common printed circuit board (PCB) in the electronics industry, FR-4, is defined by its structure (glass fiber in an epoxy matrix) and its compliance to UL 94 V0 standard....

Publisher: DfR Solutions (acquired by ANSYS Inc)

DfR Solutions (acquired by ANSYS Inc)

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting

College Park,

Consultant / Service Provider

Broadband Printing - A Paradigm

Dec 03, 2008 | Arun S. Ramasubramanian, Dr. Daryl Santos; Suny Binghamton.

This paper presents the analysis from a recent printing study employing a test vehicle that includes components such as 01005s to QFPs. In a recent publication, part of this study was presented focusing on 01005 printing only. This printing process was determined to be suitable for 01005s assembly and also analyzed based on statistical capability. The current paper will present the results from additional detailed analysis to determine if this process has the capability to provide sufficient solder paste deposits for larger components located on the same test board. In the future, the SMT industry may always look towards “Broadband Printing” as an alternative to dual stencil or stepped stencil printing technologies in order to meet the needs of both small and large components....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Advanced Electronic Connector Technologies

Nov 27, 2008 | Fred Verdi, Senior Manufacturing Engineer, ACI-EMPF.

Military electrical connectors have traditionally used very conservative design rules that provide the ruggedization needed for harsh military use environments. Commercial electronic connectors have typically used less conservative design rules that....

Publisher: Electronics Manufacturing Productivity Facility (EMPF)

Electronics Manufacturing Productivity Facility (EMPF)

The EMPF serves as a corporate residence of expertise in electronics manufacturing.

Philadelphia, Pennsylvania, USA

Controlling Copper Build Up in Automatic Soldering Equipment Using Lead-Free Solder

Nov 20, 2008 | Karl Seelig, David Suraski.

The Sn/Ag/Cu family of alloys is the leading candidate for a lead-free alternative. The first part of this study was to determine if there is any significant difference between Sn/Ag/Cu alloys when used in automatic soldering equipment in terms of copper build-up in the system. The study compared two Sn/Ag/Cu alloys to determine if at processing temperatures one alloy would absorb less copper than the other alloy....

Publisher: AIM Solder

AIM is a leading global manufacturer of solder assembly materials for the electronics industry.

Montreal, Quebec, Canada

Meeting Heat And CTE Challenges Of PCBs And ICs

Nov 13, 2008 | Kris Vasoya,

The electronics industry is facing issues with hot spots, solder joint stresses and Coefficient of Thermal Expansion (CTE) mismatch between PCB and IC substrate. Flip chip type packages for example have very low CTE compared to traditional PCB material. Thus it is necessary to have low CTE printed circuit boards in order to keep solder joint intact with such low CTE packages. There are currently several materials available in the market to address thermal and CTE challenges but each material has its own advantages and limitations......

Publisher: Stablcor

STABLCOR is an innovative Intellectual Property company that is dedicated to solving problems through design.

Costa Mesa, California, USA

Method for Automated Nondestructive Analysis of Flip Chip Underfill

Nov 06, 2008 | Steven R. Martell, Ameya Mandlik and Kieren Mercer.

For many years Acoustic Micro Imaging (AMI) techniques have been utilized to evaluate the quality of the underfill used to support the solder bump interconnections of Flip Chip type devices. AMI has been established as one of the few techniques that can provide reliability and quality control data, but little has been done to automate the evaluation process for Flip Chip underfill until now....

Publisher: Sonoscan, Inc.

Designer & Manufacturer of Acoustic Microscopes for Nondestructive Component Inspection.

Elk Grove Village, Illinois, USA

Consultant / Service Provider, Manufacturer

Integrated Offset Placement in Electronics Assembly Equipment - The Answer for Solder Paste Misalignment

Oct 29, 2008 | Juki Corp.

Growing demand for compact, multi-function electronics products has accelerated component miniaturization and high-density placement, creating new challenges for the electronics manufacturing industry. It is no longer adequate to simply place parts accurately per a pre-defined CAD assembly program because solder paste alignment errors are increasing for numerous reasons. The solution to this problem is a system in which the placement machine can automatically detect and compensate for misalignment of the solder paste to produce high-quality boards regardless of the process errors beforehand....

Publisher: Juki Automation Systems

Juki Automation Systems

Juki Automation Systems Inc. is one of the worlds leading SMT placement companies with over 45,000 machines installed worldwide and is the pioneer of the modular automated assembly line. see www.jukiamericas.com for more info.

Morrisville , North Carolina, USA

Flex Crack Mitigation

Oct 23, 2008 | Bill Sloka, Ceramic Technical Consultant, KEMET Corporation

As part of continuous process improvement at KEMET, most failure modes caused by the capacitor manufacturing process have been systematically eliminated. Today these capacitor manufacturing-related defects are now at a parts per billion (PPB) level. Pareto analysis of customer complaints indicates that the #1 failure mode is IR failure due to flex cracks....

Publisher: KEMET Electronics Corporation

KEMET Electronics Corporation

KEMET offers the world's most complete line of surface-mount and through-hole capacitor technologies across tantalum, ceramic, film, aluminum, electrolytic, and paper dielectrics.

Simpsonville,

Advanced Solder Paste Dispensing

Oct 15, 2008 | Asymtek

Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices....

Publisher: ASYMTEK Products | Nordson Electronics Solutions

ASYMTEK Products | Nordson Electronics Solutions

A leader in automated fluid dispensing, jetting, and conformal coating. Products include stand-alone dispensing workstations and fully automated, in-line conveyorized systems with advanced process controls.

Carlsbad, California, USA

High-Speed Stamp Soldering

Oct 09, 2008 | Todd O’Neil.

This article examines stamp soldering, a solution that provides consistent high quality by repeatedly applying accurate amounts of molten solder onto a printed circuit board using static volumetric solder stamps guaranteeing total flatness during the through-hole soldering process....

Publisher: Juki Automation Systems

Juki Automation Systems

Juki Automation Systems Inc. is one of the worlds leading SMT placement companies with over 45,000 machines installed worldwide and is the pioneer of the modular automated assembly line. see www.jukiamericas.com for more info.

Morrisville , North Carolina, USA

An Alternative Dispense Process for Application of Catalyst Films on MEA's

Oct 01, 2008 | Horatio Quinones, Brian Sawatzky.

This paper proposes an integrated system for film application process than consists of closed loop mass calibration to assure film thickness, a noncontact fast jetting process with high edge definition capable of applying films for highly selective areas and patterns. A system to obtain homogeneity of the solid-fluid mix is described and results are shared....

Publisher: ASYMTEK Products | Nordson Electronics Solutions

ASYMTEK Products | Nordson Electronics Solutions

A leader in automated fluid dispensing, jetting, and conformal coating. Products include stand-alone dispensing workstations and fully automated, in-line conveyorized systems with advanced process controls.

Carlsbad, California, USA

New Life for Aging Electronic Products

Oct 01, 2008 | Paul Nickelsberg, President and Senior Engineer, Orchid Technologies.

Many Original Equipment Manufacturers, (OEM’s), struggle to continue shipping aging or obsolete electronic products. Electronic products designed five to ten years ago are still relevant in the marketplace. Often these venerable old products have gained particular acceptance amongst a select group of customers. In many cases these old products fulfill a need in a unique manner. Examples include: designs that are grandfathered into an application due to regulatory considerations; designs having unique form-fit-and-function; designs running special software ; designs subject to contractual support and service requirements; designs in which a new contract stipulates delivery of older gear as part of a larger system offering. Any one or all of these reasons can lead an OEM to continue the production of electronic equipment well into its end of useful component life...

Publisher: Orchid Technologies Engineering & Consulting, Inc.

Orchid Technologies Engineering & Consulting, Inc.

Orchid develops custom electronic products for OEM's.

Maynard, Massachusetts, USA

Consultant / Service Provider, Manufacturer

Facedown Low-Inductance Solder Pad and Via Schemes

Sep 04, 2008 | John Prymak, Erik Reed, Allen Mayar

In the quest for lower ESL devices, having the ESL reduced in the package is only half of the battle; connecting that device to the circuit determines how much of that low ESL appears to the circuit. For this low ESL part type, it would be a shame to take a part of 200 pH and add 2000 pH to its ESL because of via patterns on the PCB....

Publisher: KEMET Electronics Corporation

KEMET Electronics Corporation

KEMET offers the world's most complete line of surface-mount and through-hole capacitor technologies across tantalum, ceramic, film, aluminum, electrolytic, and paper dielectrics.

Simpsonville,

Effect of Contact Time on Lead-Free Wave Soldering

Aug 28, 2008 | Jim Morris, Richard Szymanowski

The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics of the solder wave for adequate hole fill is an essential step in achieving a reliable process. A variety of solder waves exist in the industry; each with advantages and disadvantages when performing lead-free wave soldering. One way to ensure adequate hole-fill is by increasing contact time at the Chip Wave....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Lean Kitting: A Case Study

Aug 20, 2008 | Ranko Vujosevic, Ph.D. Optimal Electronics Corporation Jose A. Ramirez, Larry Hausman-Cohen, and Srinivasan Venkataraman The University of Texas at Austin Department of Mechanical Engineering Austin, Texas

Kitting is the first step in printed circuit board assembly. It is initiated well in advance of the actual production start to be able to prepare and deliver the kit on time. Kitting involves the gathering of all the parts needed for a particular assembly from the stockroom and issuing the kit to the manufacturing line at the right time and in the right quantity. This paper discusses kitting, describes ways to eliminate waste in different phases of kitting, and illustrates lean kitting using a case study conducted in a major contract manufacturer site....

Publisher: Optimal Electronics Corporation

Optimal Electronics Corporation

A global provider of innovative manufacturing execution system (MES) solutions for the electronics assembly industry.

Austin, Texas, USA

Consultant / Service Provider

XRF- A Reality Check

Aug 14, 2008 | Sia Afshari

The Restriction of Hazardous Substances (RoHS) regulations of the European Union, and similar regulations being enacted around the world, require the virtual elimination of lead (Pb), mercury (Hg), cadmium (Cd), hexavalent chromium (Cr6), polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE) from electronic products. Allowable concentration levels in any homogeneous material contained within a product are extremely low: 0.01% for Cd and 0.1% for other substances by weight. The most significant issue affecting the practical validation of RoHS compliance in the day-to-day assembly environment is ensuring that no restricted substances, especially tin-lead (SnPb) materials, have inadvertently entered into the production stream....

Publisher: RMD Instruments

RMD Instruments

Since 1974 RMD has been providing innovative solutions across a broad range of security, medical and industrial applications, including radiation imaging and detection, nuclear instrumentation and non-destructive test equipment.

Watertown, Massachusetts, USA

Selection Of Wave Soldering Fluxes For Lead-Free Assembly

Jul 10, 2008 | Chrys Shea, Sanju Arora, Steve Brown

This paper reviews the J-STD-004 and how it is used in flux categorization and selection. It also discusses the major types of flux formulations available, and the design, process and reliability implications of using each type. The purpose of the paper is to help the reader make an informed choice when selecting wave solder fluxes for lead-free processing....

Publisher: Cookson Electronics

Cookson Electronics

Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Lakeville, Minnesota, USA

Lead-Free Reliability - Building It Right The First Time

Jul 01, 2008 | Peter Biocca

As lead-free and RoHS compliancy fast approaches, it is more important than ever to build it right the first time. Lead-free assembly and RoHS will bring about numerous changes and the number of variables with which to contend is increasing, creating increased risk of defects and reduced product reliability. However, understanding what the variables are and their impact on the assembly can great increase product reliability....

Publisher: Kester

Kester is a leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Printable Nanocomposites for Electronic Packaging

Jun 25, 2008 | Endicott Interconnect Technologies, Inc.

Printing technologies provide a simple solution to build electronic circuits on o low cost flexible substrates. Nanocomposites will play important role for developing advanced printable technology. Advanced printing is relatively new technology and need more characterization and optimization for practical applications. In the present paper, we examine the use of nanocomposites or materials in the area of printing technology....

Publisher: i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Enterprise-wide Supplier Quality Management: The Big Payoff for Global SPC

Jun 04, 2008 | Zontec Inc.

The convergence of a wide range of global influences is having a profound effect on current-day quality in manufacturing. Today's operational strategies must take into account business cycles, risk-based management, logistics, workflows, outsourcing, regulatory issues, product development, corporate mergers and acquisitions. In this ever-changing economy it is imperative that companies compete more effectively on two fronts: by reducing costs and emphasizing quality....

Publisher: Zontec, Inc.

SPC software manufacturer. Our software includes such extras as defect tracking, traceability, trend and root cause analysis, overall equipment effectiveness (OEE), rolled throughput yield (RTY), equipment uptime/downtime and supplier quality management in a true real-time production-based system.

Cincinnati, Ohio, USA

Consultant / Service Provider

Solder Paste Inspection Technologies: 2D-3D Correlation

May 28, 2008 | Rita Mohanty, Vatsal Shah; Speedline Technologies, Paul Haugen, Laura Holte; Cyber Optics Corp.

This paper describes correlation between a true 2D area measurement (e.g. printer) and a height map generated area from a SPI system. In addition, this paper will explore the correlation between area/volume measurements and bridge detection between 2D/3D techniques. The ultimate goal is to arm the process engineers with information that can be used to make decision that will impact defects, cost, throughput and Return On Investment....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Pages: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36

SMTnet
»
Technical Library

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.

Text Ad | "DONGGUAN KINGSUN AUTOMATION provides new & used SMT machines, peripheral equipment and accessories sales; Equipment maintenance & technical services, SMT full line solution and Clean Room/ESD engineering materials production, design, and installation services."

World's Best Reflow Oven Customizable for Unique Applications

© 1995-2024 SMTnet