Underfill Dispensing For Aerospace Military And Defense
Published: |
August 16, 2023 |
Author: |
GPD Global, Inc. |
Abstract: |
One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC epoxy encapsulant. This process dissipates stress on solder joints and prevents cracking and fracturing between the bottom of the die and the surface of the substrate.... |
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