Reliable Novel Nickel-Free Surface Finish Solution For High-Frequency Pcb Applications
Published: |
July 6, 2021 |
Author: |
Ariel McFalls, Sam Rhodes, and Kunal Shah, Ph.D. |
Abstract: |
The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer. Among the primary factors affecting the integrity of high-frequency signals is the surface finish applied on PCB copper pads – a need commonly met through the electroless nickel immersion gold process, ENIG. However, there are well-documented limitations of ENIG due to the presence of nickel, the properties of which result in an overall reduced performance in high-frequency data transfer rate for ENIG-applied electronics, compared to bare copper.... |
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