Sample Preparation For Mitigating Tin Whiskers In Alternative Lead-Free Alloys
Published: |
February 18, 2016 |
Author: |
Mehran Maalekian, Karl Seelig, Timothy O'Neill |
Abstract: |
As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry. Current research shows that there is no perfect alloy for all cases of electronic usage. Industry leaders and researchers continue to study and search for a lead free alloy that is able to withstand harsh environments while maintaining high reliability.... |
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