Printing of Solder Paste - A Quality Assurance Methodology
Published: |
October 1, 2015 |
Author: |
Lars Bruno and Tord Johnson Ericsson AB and MTEK Consulting AB |
Abstract: |
Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix between large modules and small chip components on large and densely populated printed circuit boards. Having a process for quality assurance of the solder paste print is fast becoming a necessity. This article describes a method to ensure quality secured data from both solder paste printers and inspection machines in electronic assembly manufacturing. This information should be used as feedback in order to improve the solder paste printing process.... |
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