Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences
Published: |
January 15, 2009 |
Author: |
Peter Biocca, Senior Market Development Engineer, Kester. |
Abstract: |
Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice. SAC305 was endorsed by the IPC Solder Value Product Council in the United States as the preferred option for SMT assembly; most assemblers have transitioned to this alloy for their solder paste requirements. The SAC305 alloy due to its 3.0% content of silver is expensive when compared to traditional 63/37 for this reason many wave assemblers are opting for less costly options such as tin-copper based solders for their wave, selective and dip tinning operations.... |
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