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SMTnet Express, January 18, 2024, Subscribers: 25,307, Companies: 11,994, Users: 28,650

█ Electronics Manufacturing Technical Articles

Package on Package (PoP) Stacking and Board Level Reliability, Results of Joint Industry Study

This paper presents the results of a joint - three way study between Amkor Technology, Panasonic Factory Solutions and Spansion in the area of package on package (PoP) board level reliability (BLR) (...) The scope of this paper is to cover the already popular 14 x 14mm PoP package size that provides a 152 pin stacked interface which supports a high level of flexibility in the memory architecture for multimedia requirements.

Credit: Amkor Technology, Inc.

The Challenges Of Package On Package (Pop) Devices During Assembly And Inspection

Ball Grid Array devices, BGAs, are widely used in a vast range of products including consumer, telecommunications and office based systems. As an area array device of solder joints, it provides high packing density with a relatively easy introduction cycle. However, over the last couple of years engineers have started to experiment, and in some cases implement, stacked packages, of the type often called Package on Package, or POP. In simple terms, POP devices are the stacking of components, one on top of the other, either during the original component manufacture or during printed board assembly.

Credit: Electronic Presentation Services

Characterization of Solder Defects on Package on Packages with AXI Systems for Inspection Quality Improvement

As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes.

Credit: Flex (Flextronics International)

Assembly Reliability of TSOP/DFN PoP Stack Package

Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-on-package (PoP) that offers a reduction in overall PCB board area requirements while allowing for increases in functionality. It utilizes standard, readily available device packaging methods in which high-density packaging is achieved by: (1) using standard "packaged" memory devices, (2) using standard 3-dimensional (3-D) interconnect assembly. The stacking approach provides a high level of functional integration in well-established and already functionally tested packages. The stack packages are built from TSOP packages with 48 leads, stacked either 2-high or 4-high, and integrated into a single dual-flat-no-lead (DFN) package.

Credit: Jet Propulsion Laboratory

Package-on-Package (PoP) for Advanced PCB Manufacturing Process

In the 1990's, both BGA (Ball Grid Array) and CSP (Chip Size Package) are entering their end in the front-end packaging materials and process technology. Both BGA and CSP like SMD (Surface Mount Device) from the I 980's and THD (Through-Hole mount Device) from the 1970's are reaching its own impasse in terms of maximizing its electrical, mechanical, and thermal performances, size, weight, and reliability.

Credit: Samsung Electro-Mechanics

RESULTS of Searches for related keywords - "package on" (173)

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█ Printed Circuit Board Assembly & PCB Design Forum

https://smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=24301&mc=3

applying ink to Panel of PCB's -- Does anyone have experience of using a stainless Fine Grain SMT stencil for the purposes of applying ink to bare PCB's? We are exploring the possibility of getting a stencil to apply a letter that reflects the revision to each of 25 PCB's in a panel. We plan to utilize our MPM Momentum paste printer (we currently do it by hand) to ink these as a batch before SMT production. Basically, we would be adding to the silk screen. We are unable to have the silk changed as the customer supplies the boards, and requires the ink to reflect the current assembly revision. Basically they don't want to change their PCB revision/gerbers every time they roll their assembly revision. I am unsure if a Fine Grain Stainless SMT stencil or a different material such as a mesh stencil would be best. I tend to believe a rubber squeegee would work best, but again I am unsure. I am looking for any information or experience anyone may have.

Iron (Fe) contamination in selective solder joints -- Trying to understand the impact of iron contamination above IPC recommendations (0.02%) on selective solder joints. Brittleness and discolouration are known but are there other factors that should be accounted for?

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█ SMT, PCB Electronics Assembly Manufacturing Industry News

Electronics Industry Welcomes Pentagon's New National Defense Industrial Strategy The following is a statement by Richard Cappetto, Senior Director, North American Government Relations at IPC, the electronics manufacturing association, on the release of the National Defense Industrial Strategy (NDIS) yesterday by the U.S. Department of Defense. A fuller statement is in this IPC Blog.... Association Connecting Electronics Industries (IPC)
I.C.T's Intelligent SMD Storage System: Revolutionizing SMT Discover efficiency with I.C.T's Intelligent SMD Storage. Streamline processes, optimize space, and elevate SMT production globally. Explore now!... I.C.T ( Dongguan ICT Technology Co., Ltd. )
Gen3 to Release Next Generation CM Series Contaminometer in Q1 2024 Gen3 proudly introduces the revolutionary CM Series Contaminometer, set to be available from the first quarter of 2024. This new Process Ionic Contamination Tester boasts an array of groundbreaking features designed to elevate user experience and provide unparalleled measurement capabilities.... Gen3 Systems

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█ SMT / PCB Products & Services

NEW SMT / PCB EQUIPMENT & SERVICES - For Sale

PCB SOFTWARE

ProntoSELECTIVE-SOLDERING

Unisoft

PCB ASSEMBLY

PCB Fab & Assembly

Imagineering

PCB REFLOW OVEN

1910 MK5 Dual Lane, Dual Temperature Reflow Oven

Heller

PCB DISPENSING

DS Series Dispensers for Large Boards

GPD Global

Inspection

Dongguan I.C.T AOI Solution

Dongguan I.C.T

SELECTIVE SOLDERING

Pillarhouse Jade Handex

Pillarhouse USA

PCB INSPECTION

MS-11 High Speed In-Line SPI System

Mirtec

VIEW MORE NEW PRODUCTS...

█ SMT / PCB Assembly Equipment Auctions

Currently, no featured auctions are on SMTnet

SEE MORE AUCTIONS...

█ Electronic Equipment Market

MARKET - Used Electronic Assembly Machines For Sale

Soldering - Selective

Juki Cube 460

Baja Bid

PCB PRINTING

DEK NEOHORIZON 03iX

SMTUnion - DEK NEOHORIZON 03iX

SMTUnion

Gen'l Purpose T&M

Zeiss LSM-880 Laser Scanning Microscope

World Equipment Source, LLC

Adhesive Dispensers

Musashi FAD2500

KD Electronics Ltd.

AOI INSPECTION

Viscom S3088 Ultra Chrome 3D AOI

Lewis & Clark Viscom S3088 AOI

Lewis & Clark

MORE EQUIPMENT & PARTS...

SUBMIT YOUR RFQ ....

MARKET - Used PCB Assembly Equipment Wanted To Buy

PCB TEST

Agilent 3070

Lewis & Clark Agilent 3070

Lewis & Clark

PCB TEST

Agilent 3070

KD Electronics Agilent 3070

KD Electronics

Soldering - Wave

Electrovert VectraElite

Baja Bid

P&P / FEEDERS

Assembleon MG-1R

World Equipment Source Assembleon MG-1R

World Equipment Source, LLC

SEE Buyers' Used Assembly Equipment Wants

█ Electronics Manufacturing & Assembly Events Calendar

EVENTS

Pan Pacific Strategic Electronics Symposium | January 29 to February 1, 2024

SMTA

Wafer-Level Packaging Symposium | February 14 to 16, 2024

SMTA

█ Electronics Manufacturing Training Courses & PCB Assembly Training

FIND TRAINING FOR:

IPC Certification

Soldering & Rework

PCB Design

Electronics Assembly

Electronics Inspection

Online Training

TRAINING - PCB Inspection Electronics Manufacturing Training Courses

IPC-A-610 Specialist Interactive PCB Inspection Lab (CIS or CIT Option) Certification Training Course

Multiple dates and locations. Check the link for details

EPTAC Corporation

TRAINING - PCB Rework and Hand Soldering Training Courses

Customizable Basic Hand Soldering

Multiple dates and locations. Check the link for details

Blackfox Training Institute, LLC

TRAINING - Online Electronics Manufacturing and Assembly Training Courses

Reflow Soldering 101 Training Course

Surface Mount Technology Association (SMTA)

IPC/WHMA-A-620 Expert (CSE) Certification Training Course

EPTAC Corporation

IPC Certified Electronics Program Manager (CEPM) Training and Certification Program

Association Connecting Electronics Industries (IPC)

Component Placement 101 Training Course

Surface Mount Technology Association (SMTA)

ESD Control for Electronics Assembly

Association Connecting Electronics Industries (IPC)

MORE TRAINING COURSES...

█ Electronics Manufacturing & PCB Assembly Career Center

Job Needs & Wants

JOBS

YOUR job openings

Overseas SMT Engineer

All over the world, Alabama, USA

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

SMT Engineer, Marketing Representative, Sales Representative, Business Assistant

All over the world, California, USA

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

Installation Service Technician

Centennial, Colorado, USA

Vortex Industries

AOI Engineer

Hai Phong, Vietnam

Dongguan RuiHengHuaTai Electronic Co., Ltd

SMT Process Technician III

Racine, Wisconsin, USA

Cree Lighting

Experienced SAKI AOI programmer

All US, USA

AirDataIOT,LLC

Engineering Project Manager

Strongsville, Ohio, USA

Spartronics

Senior Quality Engineer

Williamsport, Pennsylvania, USA

Spartronics

Senior Systems Engineer

Strongsville, Ohio, USA

Spartronics

Procurement Specialist

Brooksville, Florida, USA

Spartronics

Buyer/Planner

Williamsport, Pennsylvania, USA

Spartronics

Corporate Director of Quality

Williamsport, Pennsylvania, USA

Spartronics

Automotive service Technician

Golden, CO, USA

Engage2excel

Program Manager

Williamsport, Pennsylvania, USA

Spartronics

RESUMES

YOUR resumes

POSITION: Equipment Incharge

JOB CATEGORY: Engineering , Production

CURRENT LOCATION: Tirupati, India

WILLING TO RELOCATE?: Not willing to relocate.

SUMMARY OF QUALIFICATIONS: 2 years experience on NeoLync in equipment incharge.

YOUR next job ... YOUR next employee ...

█ PCB Design & Assembly Industry Associations

Surface Mount Technology Association (SMTA)

SMTA is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

Membership Info | SMTA Certification | Bookstore | Upcoming Events

Association Connecting Electronics Industries (IPC)

IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.

Membership Info | Training & Certification | Online Store | Upcoming Events

Editor - Dave "davef" Fish (submit your technical articles)

SMTnet.com, 98 Elm Street, Portland, Maine 04101 USA, Tel.207-780-0887.

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