The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature.
While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement, voiding at any level severely compromises thermal conductivity. For example, in LED lighting modules effective conduction of heat through the 1st level die attach to the substrate and then through the 2nd level attach to the heat sink is critical to performance so that voiding in the solder joints at both levels must be minimized. (...) In this paper, the authors will review the factors that influence the incidence of voids in small and large area solder joints that simulate, respectively, the 1st and 2nd level joints in LED modules and discuss mitigation strategies appropriate to each level. They will also report the results of a study on the effect on the incidence of voids of flux medium formulation and the optimization of the thermal profile to ensure that most of the volatiles are released early in the reflow process.
Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and, most notably, center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
Juki RS-1R laser height calibration? -- Greetings,
I would like to do a height calibration, because the laser of the machine seems to be out of control, I'll explain why:
When I measure the height of a 0402 resistor, I get around -0.60 to -0.70, when I fix it on what the machines has measured, and resume production, I can see that its not being picked up and the components are on a tape near the next component, but when I switch to -0.4, it suddenly picks it up without any issue for the rest of the day.
Also, because of that, I cannot use automatic height calibration on new setups.
Any ideas?
Views: 26
Silver conductive glue in syringe - mixing -- Hello, I have litle bit simply question. I have silver conductive glue in small syringe. Can you help my how should I mix this glue in syringe before using?
Thank you.
M.
Count On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, is pleased to announce Executive Manager, Donna Shook's 25th anniversary with the company....
Juki Automation Systems (JAS), Inc. is pleased to announce its participation in the 2023 SMTA International exhibition. The event is scheduled to take place Oct. 10-11, 2023 at the Minneapolis Convention center in Minneapolis, MN. Juki's expert team will provide live demonstrations of their award-winning ISM UltraFlex 3600S and the groundbreaking Incoming Material Station in booth 1237....
MIRTEC is excited to announce its participation in the highly anticipated SMTA International Exhibition, scheduled to take place at the Minneapolis Convention Center in Minnesota from October 10-11, 2023. MIRTEC will proudly showcase its groundbreaking MV-6 OMNI 3D AOI Series featuring the exclusive OMNI-VISION® 3D Inspection Technology in booth #1201....
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