This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper. The resultant paste is injected or fills a via. The via is subsequently sintered by means of photonic sintering, or by heat in a reducing environment. The process will be accomplished in under an hour and results in ...
The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and processes that will enable the move towards sequential lamination and blind and buried via technology. Circuit board fabricators particularly in North America are adopting techniques such as via filling capability with nonconductive, high Tg, low CTE plugging pastes. This paper describes the implementation of the via filling process in a highly effective and reliable fashion for high density, high aspect ratio printed wiring boards. Close attention is paid to use of these via filling materials under high temperature assembly conditions. In addition, via plugging material requirements, equipment considerations and process limitations will be presented. Further, the pros and cons of different filling techniques are discussed. Finally, desmear and metallization techniques to insure adhesion of the plating to the filled via are presented in the context of Best Practices.
Copper-filled micro-vias are a key technology in high density interconnect (HDI) designs that have enabled increasing miniaturization and densification of printed circuit boards for the next generation of electronic products. Compared with standard plated through holes (PTHs) copper filled vias provide greater design ...
This paper describes a copper electroplating enabling technology for filling microvias. Driven by the need for faster, smaller and higher performance communication and electronic devices, build-up technology incorporating microvias has emerged as a viable multilayer printed circuit manufacturing technology. Increased wiring density, ...
Air Quality sensor for smt area -- Hi guys, So i am trying to find out what type of air quality sensor you use in your facility if any?
What other sensors are required to be installed to ensure that air quality is safe for workers?
We have both an inline oven, and a selective solder machine that have the air pushed outside but sometimes workers complain of headaches or unusual smell. One complaint was also about the jet printer running and "pushing out" funny smell.
Thanks in advance and looking forward for some input.
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Mycronic vs. Juki: Your Opinions? -- I'm looking for some general opinions on Mycronic and Juki SMT machines. The company I work for is negotiating a deal with a customer for a massive number of boards (compared to what we usually produce). We're looking into getting a whole new pick and place machine to accommodate the production needs (and potentially a full line setup, if I can convince management), as our current machine (Manncorp MC391V) isn't likely going to be up for the task.
I'm looking at Juki and Mycronic and I wanted some general opinions on the two brands from people who are experienced using them; things like ease of use, customer service, availability of used/refurbished parts, what you like/dislike about the machines, etc.
At this point in time, I don't actually know much about the board we would be making. If we get the deal, we will be designing the board ourselves so I don't actually know what I'd specifically need from the machine. About the only thing I know for certain is that we would need to produce 200+ a day (which is quite a lot for my company). We don't generally make very complicated boards so maybe a maximum of 50 parts between both sides?
Anyway, any input would be much appreciated!
The SMTA is excited to introduce a new event for manufacturers in the high reliability sector which takes place on April 18, 2023 in Kansas City, Missouri, USA. The High Reliability: Strategic Technology Advancement Research Forum will be held at the Kansas City Marriott Downtown....
Approx. (250) Fuji Feeders — Various Sizes — Electric and Pan Style
Assorted Fuji Carts and Setup Stations
In-Circuit Testers:
Agilent Medalist I 3070 ICT — 4 Module, Fully Populated, HP 3079 ICT
Screen Printers:
2019 ASM Dek NeoHorizon 03ix
Wave/Selective Soldering & Rework:
2016 Seho Power Wave Lead Free Model 84404.OF Solder
2011 Seho Power Wave Lead Free w/ Solder
Vitronics Soltec My Selective Model 6745
(2) Martin Repair BGA Repair Rework Station
Denon Instruments DIC Rework
SNC100C Solder New (28) 25-Lb Boxes
FEATURING | Closure of Global Telecom Provider — Tampa, FL Warehouse
Day 2: Complete Warehouse, (500+) Sections of Pallet Racking
Forklifts, Complete Toolroom, Compressors, Dryers
Top of the line Offices and IT Equipment
SCHEDULE | Tue, Mar 7 - Thu, Mar 15, 2023
Auction Opens: Tuesday, March 7th, 2023 at 12:00 PM (EST)
First Lot Begins to Close: Wednesday, March 15th, 2023 at 12:00 PM(EST)
Summary of Qualifications: PCB design, layout and packaging of high-speed, high-density, Mixed Technology Analog / Digital signals & RF signals, Flex, Rigid board, Commercial, Application Boards, based on client requirement and Quality Inspection of the design.
SMTA is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.