The 2017 iNEMI Board and Assembly Roadmap forecasts that, due to economic, environmental and technical drivers, use of low temperature solder pastes will increase significantly and reach 10% of all solder paste used for board assembly by 2021.
Studies and tests of comparative soldering iron thermal performance at low temperatures - Metcal direct power soldering technology compared to conventional stored energy soldering irons from leading manufacturers.
Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting temperatures of Sn-Bi solders avoid warpage wherein printed circuit board and electronic parts deform or deviate from the initial state due to their thermal mismatch during soldering. However, the addition of alloying elements and nanoparticles Sn-Bi solders improves the melting temperature, wettability, microstructure, and mechanical properties. Improving the brittleness of the eutecticSn-58wt%Bi solder alloy by grain refinement of the Bi-phase becomes a hot topic. In this paper, literature studies about melting temperature, microstructure, inter-metallic thickness, and mechanical properties of Sn-Bi solder alloys upon alloying and nanoparticle addition are reviewed
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C.
Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative ...
Component orientation -- Hi,
We are facing the issue with Component orientation(Wrong orientation), during Proto build/NPI time in SMT for 1st board placement. We are not doing 1st board with STICKY board, directly placing the components with Paste board only.
Pls suggest, How can we avoid the Wrong orientation during 1st board or any other check points need to be check during Pick &Place program.
Thank you in advance
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Leds are getting shifting during mounting when nozzles increase -- when i use only one nozzle to mounting 3535 cree power leds, it works good but when i use 2 or more nozzles, leds are getting rotated or upturned just after the nozzle relaese the led. it's like nozzle throws the led not mounts.
But not all the leds have this problem. If we have 100 leds to be places, %30 of them is placed good and others have the situtation i mention about.
Thank you. (Machine is panasonic cm)
IPC, a global electronics manufacturing industry association, has acquired media company I-Connect007, a global source for news and original content serving the printed circuit design, fabrication and assembly/EMS markets....
WPI Vision is pleased to announce the appointment of Southwest Systems Technology, Inc. as its manufacturers' representative. Southwest Systems will represent the new 3D SpectaSCOPE™ inspection microscope systems in the states of Texas, Oklahoma, Arkansas and Louisiana....
FEATURING | Please join us for our upcoming online auction featuring assets from Jabil Hungary -
Bidding Opens July 27, 2022 7:00 AM EST / 1:00 PM CEST
First Lot Begins Closing: August 3, 2022 7:00 EST / 1:00 PM CEST
Auction Link: https://bit.ly/3z8JG6L
Featuring:
2014 Vi Technology PI Primo Solder Paste Inspection
2016 Vi Technology PI Primo Solder Paste Inspection
2016 Vi Technology PI Primo Solder Paste Inspection
2005 IPTE NTM 4133 SpeedRouter
2007 Ferromatik K-TEC 275 S Injection Moulding
In conjunction with our partners at The Branford Group & Hilco Industrial
FEATURING | Please Join us for our upcoming Online Auction featuring assets from Jabil Wuhan
Bidding Opens July 28, 2022 8:00 PM EST / 8:00 AM China Standard Time.
Bid closing begins: August 2, 2022 at 9:00 PM EST in US / August 3, 2033 at 9:00 AM China Standard Time in China
Auction Link: https://bit.ly/3zynHYq
Featuring:
2014 GKG, G5 Automatic Screen Printer
Pfeiffer HLT-270 Helium Leak Detector
Temperature Chamber GDWS-300L
Wire Bonders
V Cut PCB Separator
Wire Bond Pull Testers
Vacuum Pumps
UV Curing Units
Ultrasonic Cleaner
Fiber Winder FS-230
Summary of Qualifications:
Several years working as a Mechatronic engineer in the field of automotive industry. I have worked on projects that included new product design and development, manufacturing processes, assembly lines, Continuous Improvement, quality improvement, factory equipment upgrades, industrial automation.7+years experience in SMT and THT lines for PCB manuf
Summary of Qualifications:
Reads instructions, such as work orders, drawing, and wire lists to determine materials needed and sequence of assembly, Manual Hand tool using for Wire cutting, stripping, crimping. Soldering, Splicing, Assembling PCB Boards, Boot Shrinking, Heat Shrink coating, Potting,5S Trained]
SMTA is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.