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SMTnet Express, July 21, 2022, Subscribers: 25,294, Companies: 11,589, Users: 27,357

█ Electronics Manufacturing Technical Articles

Assembly and Rework of Lead Free Package on Package Technology

Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages ...

Credits: TT Electronics - IMS

Package-on-Package (PoP) Warpage Characteristic and Requirement

Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging.

Credit: Intel Corporation

The Challenges Of Package On Package (Pop) Devices During Assembly And Inspection

Ball Grid Array devices, BGAs, are widely used in a vast range of products including consumer, telecommunications and office based systems. As an area array device of solder joints, it provides high packing density with a relatively easy introduction cycle. However, over the last couple of years engineers have started to experiment, and in some cases implement, stacked packages, of the type often called Package on Package, or POP. In simple terms, POP devices are the stacking of components, one on top of the other, either during the original component manufacture or during printed board assembly.

Credit: Electronic Presentation Services

Characterization of Solder Defects on Package on Packages with AXI Systems for Inspection Quality Improvement

As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes.

Credit: Flex (Flextronics International)

See Forum results for related keywords - pop : 350

LEARN MORE in the Technical Library... Submit Your Technical Paper...

█ Printed Circuit Board Assembly & PCB Design Forum

GSM Spindle Runout Error -- We are in process of calibrating one of our GSM machines; we were able to successfully calibrate the front and rear ULC's but when we moved on to calibrate the head we get a spindle runout error midway through the routine (pic attached.) The spindles do not appear bent and we've never had placement issues before. Does anyone know any common causes of the spindle runout error?

SMT Equipment and Oven Repair -- Hi, I am looking for a repair tech on reflow oven or SMT Equipment in Southwestern US region. Please forward any contact information and thank you. Deon deonnc@gmail.com

Search the PCB Assembly Forum Visit the PCB Assembly Forum...

█ SMT, PCB Electronics Assembly Manufacturing News

ZESTRON Academy to Host FREE "Surface Cleanliness Assessment" Webinar

ZESTRON is pleased to announce that it will host a webinar titled "Surface Cleanliness Assessment" on Tuesday, July 26th, from 11:00 AM to 12:00 PM EDT. This is the fifth installment of the ZESTRON Academy 2022 Cleaning Webinar Series and will be presented by our industry expert, Naveen Ravindran, M.S.Ch.E, M.S.Ch.E, Application Engineer....

ZESTRON Americas

Totech Canada Inc adds New Smart factory 4.0 dry cabinet product lines

Totech Canada Inc is pleased to announce the addition of TOTECH Europe New factory 4.0 dry cabinet product lines to its Totech dry cabinet lineup please view Totech Canada Inc new website for more details ......

TOTECH Canada SUPERDRY

Totech Canada Inc adds New Smart factory 4.0 dry cabinet product lines

Assure PRO Intelligent X-ray Component Counter Now Available at Demo Location in Florida

Nordson TEST & INSPECTION, a division of the Nordson Corporation (Nasdaq: NDSN), is pleased to announce that it has setup a brand new Assure™ PRO intelligent X-ray component counter at The A & E Group dba Kurt Whitlock Associates Demonstration Lab in St. Cloud, FL for live demos....

Nordson Electronics Solutions

Nordson - Assure Pro Intelligent X-ray Component Counter

GET more Electronics Assembly Manufacturing News...

█ SMT / PCB Products & Services

NEW SMT / PCB EQUIPMENT & SERVICES - For Sale

PCB DISPENSING

MAX II High Precision Dispensers

Dispensing

GPD Global

PCB PRINTING

I.C.T. Full Auto Stencil Printer

PCB Printing

I.C.T.

Cleaning Agents

pH Neutral & Alkaline Cleaning Agents

Cleaning Agents

ZESTRON Americas

Selective Soldering

Pillarhouse Jade Handex

Selective Soldering

Pillarhouse USA

PCB CLEANING

Purbest - Hydro-Clean LDS Cleaning Machine

Cleaning Equipment

Purbest Tech

PCB INSPECTION

MS-11e High Speed In-Line SPI System

Inspection

Mirtec

PCB SOFTWARE

CELLS - MES & Tracking Software

Software

Unisoft

PCB REFLOW OVEN

1910 MK5 Dual Lane, Dual Temperature Reflow Oven

Reflow

Heller

View More New Electronic Manufacturing Products...

█ SMT / PCB Assembly Equipment Auctions

Currently, no featured auctions are on SMTnet

Visit the Assembly Equipment Auctions Calendar...

█ Electronic Equipment Mart

MART - Used Electronic Assembly Machines For Sale

P&P / Feeders

Assembleon AX201

Pick and Place/Feeders

KD Electronics

PCB INSPECTION

YesTech YTV-FX

Baja Bid - YesTech YTV-FX

AOI / Automated Optical Inspection

Baja Bid

PCB INSPECTION

Viscom S3088 Ultra Chrome 3D AOI

Lewis & Clark Viscom S3088 AOI

AOI / Automated Optical Inspection

Lewis & Clark

P&P / Feeders

Assembleon /Yamaha Opal-X II Pi

World Equipment Source - Assembleon /Yamaha Opal P&P

Pick and Place Equipment/Feeders

World Equipment Source, LLC

P&P / FEEDERS

Panasonic NPM-W P&P

AllSurplus Panasonic NPM-W P&P

Pick and Place/Feeders

AllSurplus

PCB PRINTING

DEK NEOHORIZON 03iX

SMTUnion - DEK NEOHORIZON 03iX

Screen Printing Equipment

SMTUnion

View More Used Equipment For Sale... Send a RFQ to Equipment Suppliers ....

MART - Used PCB Assembly Equipment Wanted To Buy

PCB TEST

Agilent 3070

Lewis & Clark Agilent 3070

In-Circuit Testers

Lewis & Clark

PCB TEST

Agilent 3070

KD Electronics Agilent 3070

In-Circuit Testers

KD Electronics

WIRE STRIPPERS

Autosplice SAS/2

Baja Bid - Autosplice SAS/2

Wire Stripping Machines

Baja Bid

P&P / FEEDERS

Assembleon MG-1R

World Equipment Source Assembleon MG-1R

Pick & Place/Feeders

World Equipment Source, LLC

See Buyers' Used Assembly Equipment Wants

█ Electronics Manufacturing & Assembly Events Calendar

EVENTS

Multi Chapter/Continent Webinar Series: Thermal Interface Solutions (Presented by India Ch.) | July 22

SMTA

Surface Cleanliness Assessment July 26TH | July 26

ZESTRON

Wisconsin Chapter: 4th Annual Golf Outing | August 16

SMTA

Queretaro Expo & Tech Forum | August 18

SMTA

█ Electronics Manufacturing Training Courses & PCB Assembly Training

FIND TRAINING FOR:

IPC Certification

Soldering & Rework

PCB Design

Electronics Assembly

Electronics Inspection

Online Training

TRAINING - Electronics Manufacturing and PCB Assembly Training Courses

IDEA-STD-1010 Essentials For Counterfeit Component Identification Online Live

New Hampshire, Manchester

Aug. 01 to Aug. 02, 2022

EPTAC Corporation

Counterfeit Components Workshop Online Live Training

New Hampshire, Manchester

Aug. 03, 2022

EPTAC Corporation

Component Identification Online Live Certification

New Hampshire, Manchester

Oct. 28, 2022

EPTAC Corporation

TRAINING - PCB Inspection Electronics Manufacturing Training Courses

SMT Processes Certification Course - Chihuahua

Alabama, Mexico, To Be Determined

Aug. 23 to Aug. 25, 2022

Surface Mount Technology Association (SMTA)

SMT Processes Certification Course - Guadalajara

Alabama, Mexico, Guadalajara, Jalisco

Sep. 19 to Sep. 21, 2022

Surface Mount Technology Association (SMTA)

610 Interactive Inspection Lab

Connecticut, Watertown

Oct. 07, 2022

EPTAC Corporation

TRAINING - PCB Rework and Hand Soldering Training Courses

Customizable Basic Hand Soldering

Arizona, Phoenix

Aug. 29 - Aug. 31, 2022

Sep. 19 - Sep. 21, 2022

Blackfox Training Institute, LLC

Hand Solder Rev 8 Certification Course

California, Anaheim

Nov. 28 to Dec. 02, 2022

EPTAC Corporation

TRAINING - Online Electronics Manufacturing and Assembly Training Courses

IPC J-STD-001 Trainer (CIT) Certification Online Live Training Course

Online/On-Demand

EPTAC Corporation

Live Online Training - IPC/WHMA-A-620 Expert (CSE) Certification Training Course

Online/On-Demand

ACI Technologies, Inc.

Live Online Training - IPC/WHMA-A-620 Trainer (CIT) Certification Training Course

Online/On-Demand

ACI Technologies, Inc.

Live Online Training - IPC-A-610 (CIT) Recert.

Online/On-Demand

ACI Technologies, Inc.

Reflow Soldering 101 Training Course

Online/On-Demand

Surface Mount Technology Association (SMTA)

Visit All Electronics Manufacturing Training Courses...

█ Electronics Manufacturing & PCB Assembly Jobs

CAREER CENTER - Job Needs & Wants

JOBS - Post your job openings now

Lead Application Laboratory Technician

Manassas, VA

ZESTRON

Field Service Engineer

Florham Park, NJ

Heller Industries Inc.

SMT Process Engineer

Milwaukee, WI

Cree Lighting

Soldering Technician, Touch-up for PCBAs

Santa Cruz, CA

Dynamic Engineering

Business Development Sales Manager, Microelectronics

Suwanee, GA

MacDermid Alpha Electronics Solutions

Solderer

Nashville, NC

ACDi

RESUMES - Post your resume now

Posiition: Assembly Operator

Currrent Location: India, Trivandrum

Summary of Qualifications: Reads instructions, such as work orders, drawing, and wire lists to determine materials needed and sequence of assembly, Manual Hand tool using for Wire cutting, stripping, crimping. Soldering, Splicing, Assembling PCB Boards, Boot Shrinking, Heat Shrink coating, Potting,5S Trained]

Posiition: Engineer

Currrent Location: India, Palakkad

Summary of Qualifications: I had 4 years experience 3 years in SMT Field and 1 year in Stock Market I have well experience in SMT process and machine Knowledge personally I have well knowledge on reflow, SPI,DEK AOI I can handle the process related issues and tackle the situation

Post your resume on SMTnet

Find your next job now... Find your next employee now...

█ PCB Design & Assembly Industry Associations

Surface Mount Technology Association (SMTA)

SMTA is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

Membership Info | SMTA Certification | Bookstore | Upcoming Events

Association Connecting Electronics Industries (IPC)

IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.

Membership Info | Training & Certification | Online Store | Upcoming Events

Editor - Dave "davef" Fish (submit your technical articles)

SMTnet.com, 98 Elm Street, Portland, Maine 04101 USA, Tel.207-780-0887.