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SMT Express, Volume 5, Issue No. 7 - from SMTnet.com
 

Aligning the design and supply chains
Component selection is often based on design and technology needs alone, with little thought given to downstream supply chain/manufacturing concerns. This can result in serious and costly problems that can be avoided with good business processes.

Posted by Design Chain Associates, LLC
How to Select the Best Stencil for SMT and Advanced IC Package Printing
The stencil selection process can be confusing, particularly when creating a stencil for a new application. This tutorial, which covers stencils for SMT and advanced IC packaging applications, offers guidelines to assist users in stencil selection and print optimization.

Posted by Peter Carry
 
Volume 5, Issue No. 7
June 18, 2003


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Agilent Technologies Receives Award
Frost & Sullivan's 2003 Product Line Award
Lectronix Receives Certifications
ISO/TS 16949:2002 and ISO9001: 2000 Certifications
CirTran New Business Order Trend
YTD Orders From New Customers Have Exceeded $1M
Mentor Acquires Assets of DDE_EDA
Accelerates Delivery of Advanced Packaging Capabilities
Sanmina-SCI's Wilmington PCB Plant Certified
Facility Achieves Military Qualification
Arrow Electronics Announces Restructuring Plans
Continues To Improve Operating Efficiencies
Withdrawal of Nam Tai's Registration Statement
Cites the Effect of SARS on Stock Market
NEC Electronics Appoints Corporate Auditor
Yasuo Matoi Appointed As New Corporate Auditor
DuPont Appoints Insulectro as National Distributor
For DuPont Electronic Technologies Circuit Materials

NEMI's Test Strategy Project
Manufacturing Test Strategy Cost Model Released
Phoenix Contact Introduces New Power Connectors
Power Connectors Bring Heavy Cables Onboard
Mentor Graphics Unveils Design Tool Flow
Addresses Challenges of Designing Complex FPGAs
Allegro MicroSystems Offers New SG Package
Package Provides Integrated Hall-effect Solution
DuPont Price Increase for Riston�
Price Increase of 4 to 7 Percent
Spray Stencil Cleaners from Smart Sonic
Now More Effective and Environmentally Safe
Vicor Unveils V�I Chip Bus Converters
consists of 48V to 12V Bus Converter Modules
SQC in Electronics Manufacturing
NWA Quality Analyst Softwear Applications
Vishay Siliconix Monolithic Dual JFETs
Eliminate Latch-Up In Amplifier Designs
DMI International's Universal Overhead Top Hat
Adaptive Tool Prevents Components Floating Off
DEK and PacTech Join Forces
High-Volume Wafer Bumping Solution
Virtex-II FPGA Prototyping Boards
FPGA Design Evaluation & Testing

VOC-Free Liquid Flux Development
Minimum Defects and Lead-free Wave Soldering Compatibility
From Circuits Assembly
The Way We See It
China Not 'Immune' to Manufacturing Challenges
From CircuiTree
The Plating Rack
Drilling to the Source of Voids
From Printed Circuit Design and Manufacture
Reworking Plastic
And Other Heat-sensitive Components
From SMT Magazine
Speeding Up the Conversion Period
Making the Change to Lead-Free Products
From EP&P
Electronics Assembly
Soldering Soldiers
From Assembly Magazine
North American Market Improving
SARS Scrambling Global Picture
From PCB 007
 
Electrovert OmniFlo 10E
Posted by Digital Technologies
Smartsonic or Similar Ultrasonic Stencil Cleaner
Wanted by Pro-Con Technologies
Conceptronics HVA102r(FF) Reflow Oven
Posted by Global Technology Trading

Moisture free storage units.
Posted by John Luckham
I am looking for information concerning desiccator cabinets...
Automation Equipment Registration Fees
Posted by Jason Gregory
We have been informed that the mfr. will no longer support the equipment without us first paying a registration fee. This I can understand, however... We are being told we have to pay 3k for EACH machine!!!!!!
Wave soldering profiling
Posted by Frank
I was wondering if there is a profile with respect to wave soldering? Is there a document I can refer to get this information?
BGA inspection scope - Visual
Posted by Tellinghuisen
Does anybody have any experiences with this type or equipment? (i.e. ERSAscopes like contraptions)

Optimizing HALT, ESS and HASS
June 23-25, 2003
IPC Designer Certification
June 24-25, 2003
International Conference on Composite Materials
July 14-18, 2003

Benchmark Electronics Elects Board Member
John Cox Appointed to the Board of Directors
Electro Scientific Industries Executive Termination
ESI Terminates CEO James Dooley
SMTEK Appoints Two New Board Members
Edward Smith and Robert Howard to Fill Vacancies
Director of Global Services Named at Universal
Announces the Appointment of Bob Lamanna

Sales Director
Company: Reptron Manufacturing
Location: Michigan
Software Engineer
Company: Aegis Industrial Software
Location: Pennsylvania
SMT Process Engineer
Company: Autosplice
Location: Tijuana, Mexico
Sales & Marketing
Company: SMTnet
Location: Maine

International Free Workshops
Two Half-day Workshops
Call for Participation
Announces Pan Pacific Symposium
International Update
Will Feature Seventeen New Courses
International Announcement
Opening Session and Annual Meeting Announced
International Announces Upcoming Events
Special Symposiums and Emerging Technologies Summit

IPC Announces Victory
Triumph Over EPA's Guidelines
IPC Releases New Tools
Release of Three Diverse Industry Products
IPC Government Relations
Industry Score Another Victory
IPC, HKPCA Reschedule Exhibition
Intl. Printed Circuit and Electronics Assembly Fair Rescheduled
IPC Book-to-Bill Ratio
IMS/PCB Business Report
IPC Updates Two Test Documents
Revised Standards on Solderability
SMTnet Express is a bi-monthly publication of SMTnet.com
Direct inquiries and comments to SMTnet
tel: 207-780-0887
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