Inline 4-Chambers Vacuum Soldering Oven with formic acid KD-V400L

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We are professional factory to produce Vacuum Soldering Oven, we have rich experience for the Recerch and Development the equipment,Welcome to us for testing your products.

Beijing, Beijing, China

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8615101546036

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(12) products in the catalog

Name:	Inline 4-Chambers Vacuum Soldering Oven with formic acid KD-V400L
Category:	Reflow
Offered by:	Chengliankaida Technology Co.,Ltd

Inline 4-Chambers Vacuum Soldering Oven with formic acid KD-V400L Description:

HVT inline 4 chamber vacuum soldering oven optimize IGBT modules with solder paste or preforming solder and the exceptional soldering result void rate will less than 3%

If you want to know about our product, contact us freely as following:
Contact: Lina.
Wechat/WhatsApp:+8615101546036
Website:www.hvttec.com

Technical parameters

Name	Vacuum Reflow Oven
Model	KD-V400
Welding size	350*400MM
Oven size (LxWxH)	395019601900mm Connected unloader size:458019601900 mm
Weight	2900 kgs
Heating zones	Front two preheating zones, Middle is Reflow zone, Behind are 4 Cooling chambers. Each temperature zone independent vacuum, Independent temperature control system. Products left in -right out, inline working.
Compatible Process	Solder paste and Preform solder
Gas	Nitrogen; Formic acid
Feed in and out	With 0.6m uploader,1.2m unloader , Air-cooling with time setting
Track	Length:330mm，Adjustable;Height:950±20mm;Carring capacity≥20kg
Effectively heating space	(280mm190mm)2 heating zone ,H≥80mm；
Height of Chamber	80mm
Max temperature of Preheating zone and Reflow zone	≥400℃;Accuracy:±1℃；
Bottom welding temperature	≥450℃
Top welding temperature	Max 300℃
Heating way	Bottom contact-type heating conduction
Cooling way	Bottom contact-type cooling
Type of Vacuum pump. Speed	With 4 oil pump( 2 Preheating zones/Reflow zone/Cooling zone,) Speed ≥100m3/h;
Min Vacuum	2 Preheating zone/Reflow zone/ Cooling zone ≤1mbar; Within2h≤5mbar；
Speed of Heating and Cooling	Max heating speed≥3℃/s; Max cooling speed≥3℃/s。
Accuracy of Soldering temperature	Temperature of Reflow tray:±2%
Max hold time of reflow temperature	≥60min,(Max：999s)；
Void Rate	Whole Void rate ≤2% Chip size (10mm10mm),Sigle Void rate≤1% ,Chip size:(10mm10mm)
Cooling Water	With independent circulating cooling water system
Temperature curve	Can setting self,(Add/Modify/Delete and so on)
Chamber with watch window	Chamber with watch window
Power	Max:35KW Working powe:12-15KW
Heating platform	Red copper special treatment
Power standard	380V, 50HZ/60HZ,3-phase five-wire,10 square copper wire
Gas	Nitrogen ,Formic acid
Control system	Siemens PLC1200 control system +YanHua IPC +Software operate