Pillarhouse Jade MKIV

Pillarhouse Jade MKIV Description:

Enhanced, entry-level, single point selective soldering system

With all the proven features of the Jade MKII, the Jade MKIV sets even higher standards of performance.

Designed to meet the needs of the small/medium batch manufacturer who requires high levels of production flexibility, the Jade MKIV offers uncompromised selective soldering quality at a very low cost.

The Jade MKIV is a handload system, incorporating a universally adjustable tooling carrier capable of accommodating PCB’s or pallets up to 508 x 610mm (20″ x 24″).

Our patented Drop-Jet design fluxer offers quick and effective flushing of the pressurised flux chamber. This helps to keep maintenance levels to a minimum whilst enabling the use of higher solid content fluxes as well as water-soluble fluxes.

Description

As part of the entry-level philosophy for this system, a low maintenance solder bath and pump mechanism has been developed which moves in three axes of movement whilst not limiting access to the PCB. Solder is applied using proven technology through our AP nozzle design or custom specialised nozzles.

As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere. This method of soldering also assists in the prevention of oxidisation and provides a local pre-heat to the joint, thus reducing thermal shock to localised components.

The Jade MKIV is controlled by a PC, through our next generation PillarCOMMX software, a Windows® based ‘Point & Click’ interface with PCB image display. Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.

Standard Features

• 508x610mm (20×24″) board size
• Integral PC and machine mounted TFT monitor
• Inerted Nitrogen system
• Motorised auto-solder top-up (wire feed) & solder level detect
• Titanium Drop-Jet fluxer
• Set of AP style solder nozzle tips
• Internal fume extraction
• Colour programming camera
• Process viewing camera
• Manual fiducial correction
• Auto-nozzle conditioning system
• Solder wave height measurement and correction
• New Solder bath and pump design
• Pump rpm monitoring
• Universally adjustable tooling carrier
• Thermal nozzle calibration system using integrated setting camera (requires manual correction)
• Enhanced PillarCOMM Windows® based ‘Point & Click’ interface
• PillarPAD offline programming package
• Multiple level password protection
• Lead-free compatible
• Day-to-day service kit

Items in bold are new features, when compared to Jade Mk II.

Monitoring Options

• Flux presence sensor – thermistor style
• Flux spray, flow and spray & flow
• Pump rpm
• O2 ppm
• Nitrogen flow

System Options

• Top side instant IR preheat
• Bottom side instant IR preheat
• Closed loop temperature control – via pyrometer or thermocouple
• Ultrasonic fluxing
• Dual Drop-Jet / ultrasonic fluxing
• Laser PCB warp correction
• Micro nozzle assembly
• Solder reel identification
• Rapid change solder bath and pump system capabilit
• Solder bath coding – identifies correct bath for program
• Nitrogen generator

Items in bold are new features, when compared to Jade Mk II.