Vimic Electronic Corporation
Vimic is expert in the design and manufacture of various types of fluid dispensing tools and a selection of Die Bonding Tools for customized applications. The offering includes Epoxy Stamping Tools, Pick-up Tools, Push up Needles.
Vimic cooperates with high-tech industries to provide fluid dispensing tools and a selection of die bonding tools based on our leading technique. In 2002, we started a R&D center in Tokyo, working on molding technology. As one of the leaders in small precision tools, Vimic is committed to providing the highest quality products & services and a focus on continuous improvement to our customized products and flexible solutions.
Most common die bonding methods such as adhesive bonding (epoxy die attach), micron-level pick-and-place and flip chip processes by using our die bonding tools. The offering includes Epoxy Stamping Tools, Die Pick-up Tools and Push-up Needles/ Die Collets with designs and features optimized for your bonding needs.
We provide kinds of dispensing nozzle with different specifications for all types of die bonders in the market including Besi (Esec 2100), ASM AD8312 Plus and HITACHI DB series, Camelot Dispenser and Nordson ASYMTEK Fluid Dispenser, etc… The offering includes Writing Pens, Epoxy Dispensing Tools, Nozzle Tips, Multi-needle Dispensing Nozzles and Jet Nozzles.
Vimic Electronic Corporation Postings
28 products »
NH05 Writing Pen/ Dispensing Nozzle Tip
Dispensing nozzle tip also known as writing pen is used to dispense the glue to the die location with the compressed air in most of dispensing process, such as die bonding, electrical circuit connection, structural and circuit board connecti...
Dispensing tools can be defined as transfer of fluid from a container (usually a syringe) to substrate, one of the best options in meeting the requirement for adhesives in a wide array of packaging assemblies. In order to...
NH11-T Common Dispensing Nozzle Tip
Common dispensing nozzle tip is used to dispense the glue to the die location with the compressed air in most of dispensing process, such as die bonding, electrical circuit connection, structural and circuit board connection....
Precision nozzle can be defined as transfer of fluid from a container (usually a syringe) to substrate, one of the best options in meeting the requirement for adhesives in a wide array of packaging assemblies. To ensure t...
NH38 High Precision Nozzle (Ceramic Dispensing Nozzle)
High precision dispensing nozzle is used to dispense the glue to the die location with the compressed air in most of dispensing process, such as die bonding, electrical circuit connection, structural and circuit board connection....
Vimic offer Die Collets and Pick-up Tools, manufactured from metallic (nickel alloy, tungsten carbide) and non-metallic (ceramic and high-temp plastic) materials to suit almost any application in bonding process. The deci...
Vimic offer Die Collets and Pick-up Tools, manufactured from metallic (nickel alloy, tungsten carbide) and non-metallic (ceramic and high-temp plastic) materials to suit almost any application in bonding process. We can d...
We can design and manufacture the tips for die attach of transistor, LED and other small die applications based on customer's demands. Die Collets common tip style& feature;...
SP02-C Single Pin Ceramic Stamping Tool
Stamping tools are also called as transfer or printing tools, the tools pick up adhesive paste from a tray and stamps the adhesive paste down on to the target pad. Adhesive stamping tools come in various...
SP02-TU2 Double Pin Epoxy Stamping Tool
Epoxy stamping tools come in various design such as single dot, star, cross and multi-tip and widely used in LED industry because of its simplicity and low cost. We manufacture hard material- tungsten carbide and ceramic materials t...
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