Automatic Visual Solder Paste Printer,SMT Stencil Printer (MX)

Company Information:

Shenzhen HTGD Intelligent Equipment Co., Ltd is focus on solder paste( screen printer), AOI, SPI, dispenser, loader, unloader, conveyor, reflow oven, design and produce and provide SMT/DIP whole line service.

Shenzhen, China

Manufacturer

0086 176 0509 3701

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Company Postings:

(1) SMT parts, accessories & PCB supplies item

(23) products in the catalog

(3) news releases

Name:	Automatic Visual Solder Paste Printer,SMT Stencil Printer (MX)
Category:	Printing
Offered by:	Shenzhen HTGD Intelligent Equipment Co., Ltd.

Automatic Visual Solder Paste Printer,SMT Stencil Printer (MX) Description:

Automatic Visual Solder Paste Printer,SMT Stencil Printer (MX)

Product Overview:

Easy to learn and use

High precision and high stability
Single or Back to Back are both available.

With CE Certificate/ Award Certificate/ Software work Certificate/ Software ework Certificat/ Certificate of Authorization.

Technical Parameters:

PCB parameters
Maximum board size(X x Y)	450mm x 350mm
Minimum board size(X x Y)	50mm x 50mm
PCB thickness	0.4mm~6mm
Warpage	≤1%Diagonal
Maximum board weight	3Kg
Board margin gap	Configuration to 3mm
Maximum bottom gap	20mm
Transfer speed	1500mm/s(Max)
Transfer height from the ground	900±40mm
Transfer orbit direction	Left-Right,Right-Left,Left-Left,Right-Right
Transfer mode	One stage orbit
PCB damping method	Programmable elastic sidec lamp + Automatic adjustment PCB thickness+ Edge locking and pressing PCB (Option:1 .B ottom integral cavity type vacuum;2.Bottom multi-point local vacuum)
Support method	Magnetic thimble + Equal high block.(Optional:1.vacuum suction cavity;2.special workpiece fixture)
Printing parameters
Printing head	Floating intelligent printing head with servo motor drive and Precision screw drive(Two independent motorized print heads)
Template frame size	470mm x 370mm~737 mm x 737 mm
Maximum printing area(X x Y)	450mm x 350mm
Squeegee type	Steel Squeegee/Rubber Squeegee(Angel 45°/50°/60° matching the printing process
Squeegee length	300mm(optional with length of 200mm-500mm)
Squeegee height	65±1mm
Squeegee thickness	0.25mm Diamond-like carbon coating
Printing mode	Single or double scraper printing
Demoulding length	0.02 mm - 12 mm
Printing speed	0 ~ 200 mm/s
Printing pressure	0.5kg - 10Kg
Printing stroke	±200 mm (From the center)
Cleaning parameters
Cleaning mode	1. Prepose programmable washer fluid injection system; 2. Dry, wet and vacuum modes
Length of cleaning and wiping board	300mm+450mm(optional with 380mm)
Image parameters
Field of view	8mm x 6mm
Platform adjustment range	X:±5.0mm,Y:±7.0mm,θ:±2.0°
Benchmark point type	Standard Fiducial type( Circle, triangle, square, diamond, cross)(SMEMA standard),solder pad/openings
Camera system	Independent camera,upwards/downwards imaging vision system,geometric matching location
Performance parameters
Repetition precision of image calibration	±10.0μm @6 σ,Cpk ≥ 2.0
Repetition precision of printing	±15.0μm @6 σ,Cpk ≥ 2.0
Cycle time	<7s(Exclude printing and cleaning)
Product changeover	<5min
Equipment
Power requirements	AC220V±10%,50/60HZ,15A
Compressed air requirements	4~6Kg/cm2
Operating system	Windows XP(Optional WIN7)
External dimension	1162mm(L) x 1420mm(W) x 1540mm(H) (Excluding tricolor lamp,monitor and keyboard)
Machine weight	Around 1000Kg

1. Automatic solder paste filling function
Regular and fixed point automatic addition of solder paste,to ensure the quality of solder paste and the amount of solder paste in the stencil. In order to ensure that the customer can carry out the quality of stable and continuous printing for a long time, improve productivity.
Can be real-time monitoring the roll diameter of the solder paste on screen trigger automatically add functionality

2. Detection function of solder paste margin of stencil
Real time detection of solder paste margin (thickness) on stencil,intelligent prompt for tin filling

3. Detection functionof Stencil plugging
By compensating the light source above the stencil, CCD is used to check the mesh in real time,so as to quickly detect and judge whether the stencil is blocked after cleaning,and carry out automatic cleaning, which is a supplement to the 2D detection of PCB.

4. Automatic dispensing function
According to different printing process requirements, PCB can be accurately dispensing tin,line drawing,filing and other functional operations after printing.

5. Squeegee pressure close-loop feedback control
Built in precise digital pressure sensor control system, through the squeegee pressure feedback system, it can accurately display the original pressure value of the squeegee,intelligently adjust the depth of the squeegee pressure,ensure the constant pressure value inthe printing process and obtain the highest process control, and realize the perfect printing of high-density and fine spacing devices.

6. Temperature and humidity control function
Automatic regulation and supervision of temperature and humidity in the printing press to ensure the stable physical characteristics of printing Materials.

7. Magnetic squeegee
Magnetic adsorption squeegee blade,instead of screw hole positioning mode, convenient and quick replacement.

8. Vacuum suction plate and upperpress function
It can automatically clamp PCB of various sizes and thicknesses to effectively overcome the deformation of the board,Make sure that the tin is evenly printed.

9. Support MES system seamless docking
It can scan the 1D code 2D code on the customer PCB and record the relevant information.which can be shared with the customer MES system. MES system uses 2D code,1D code, mobile IOT and other technologies to conduct scientific management on the warehouse material preparation and prevention, incoming material picking management, material loading and error prevention,production scheduling,quality traceability,Kanban control,etc. in the SMT production process. Through the optimization process to improve the production efficiency,improve product quality,shorten the production cycle, reduce the manufacturing cost,to achieve a comprehensive and scientific traceability management,to help enterprises quickly respond to market changes, improve the core competitiveness.

10. SPI online function interface
A closed-oop system is formed by connecting with SPI.After receiving feedback information of defective SPI printing, the machine will automatically adjust the offset according to SPI feedback. The XY offset can be adjusted automatically within 3PC.and clean the stencil, improve the printing quality and production efficiency,constitute a complete printing feedback system.

Other Available options Configuration:

Item No.	Function
1	Paste Roll Height Monitor (aPRHM)
2	Internal temperature and humidity detection on the work area
3	Window 10 system
4	Upper Press Function
5	PCB Size 525 mm * 350 mm
6	PCB board support method Grid-Lock
7	Support pins or support block detection sensor
8	Squeegee holder
9	System of adding solder paste from cartridge Semko 6 Oz
10	Control - by touch screen monitor
11	PC must have (SSD)
12	Range of adjustment feets from 45 to 160 mm
13	6.1 Software can save log-files 6. 2 Log-files contain data about all possible parameters of the equipment 6.3 Discreetness of data saving may be set up without limits 6.4 Export of log-files to Excel or Access 6.5 Alarm system in case of parameters are not correspond to preset parameters 6.6 Possibility of remote export of log files 6.7 For all parameters of the equipment there will be possibility of setting up of critical value of such parameters and further actions (means stoppage or further work with indication and information in separate log-file) with marks in log-files only in case of preset parameters will go beyond critical value.
14	UPS