SMT Equipment

FHG63505 Wire to board housing 6.35mm

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FHG63505 Wire to board housing 6.35mm

FHG63505 Wire to board housing 6.35mm

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FHG63505 Wire to board housing 6.35mm

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Components

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Beijing Yuanda Innovation Technology Co., Ltd

   

FHG63505 Wire to board housing 6.35mm Description:

Category
Category Wire to board housing
Circuits 6
Pitch 6.35mm
Wafer/Housing HG63502
Terminal FT63501
Temperature Range operating -25ºC~+85ºC
Material and Plating
Material - Resin PA66 UL94V-2

FHG63505 Wire to board housing 6.35mm was added in Feb 2019

FHG63505 Wire to board housing 6.35mm has been viewed 65 times

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