Zhuomao ZM-R6200 BGA Chip Removal Machine for Motherboard IC Repair
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Zhuomao ZM-R6200 BGA Chip Removal Machine for Motherboard IC Repair |
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Zhuomao ZM-R6200 BGA Chip Removal Machine for Motherboard IC Repair Description:
Zhuomao ZM-R6200 BGA Chip Removal Machine for Motherboard IC Repair
Product Application
Factort price automatic bga replacing machine iphone motherboard repair station ZM-R6200 can desolder and solder all the BGA Chip, remove and replace different motherboard BGA IC chip as well as other components (Lead free & lead available).
It can cut down the rework cost$ from reworking the bad motherboard, it is used widly by many mobile phone repair workshop, aftersales service center and the other store or factory who need to repair the motherboard.
With Optical alignment system, you can rework the BGA in high precision.
Advantages of BGA Rework Station ZM-R6200
1, ZM-R6200 is the highest cost-effective machine for BGA|SMD rework in Seamark ZM.
2, High automatic,easy operation for BGA rework,SMD rework, micro ic components rework.
3,Good effect of constant temperature heating,longer serve life.
4, CCD camera optical alignment system helps position precisely.
5,Built-in pressure testing device protects the PCB.
6, Laser pointer, fast positioning for PCB.
7, High Definition touch screen( up to 800*600 pixel).
8, Real-time automatic monitoring for all heaters, when accident happens, self-protection function works.
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Specification for Zhuomao semi-automatic BGA rework station ZM-R6200 |
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●power |
AC 220V±10％ 50/60 Hz |
●Temperature control |
K-type thermocouple (Closed Loop), independence temperature control, accuracy within±3℃ |
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●Total Power |
Max 5360W |
●Positioning |
V-groove, PCB support |
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●Heater power |
Top heater 1200W Bottom heater 1200W IR heater 2700W |
●PCB size |
Max 410×370 mm Min 65×65 mm |
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●Electrical material |
Intelligence Programmable controller, support connect computer |
●BGA chip |
Max 80×80mm Min 2×2 mm |
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●Dimensions |
L640×W630×H920 mm |
●External temperature sensor |
1 pc |
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●Weight |
70kg |
●Color |
white |
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●Package |
Wooden box |
●G.W. |
120KG |
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Main Features
●Mounting pressure control device is inbuilt inside the mounting head to protect PCB board from damage.
●Infrared laser positioning for PCB positioning quickly.
●Zaxis motion of the mounting head is controlled by Taiwan precise guide rail to ensure the precise running.
●Height of bottom hot air nozzle can be adjusted.
●Adopt ceramic infrared radiator for IR preheater, heating stably and uniformly with long serve life.
●Alignment system controlled by Joystick, no need setting complicated parameters.
●Gas is supplied by Delta double ball bearing axial flow fan, without need of the external gas supply.
●Temperature control system is composed with DCCE 6 channel temp. module and automatic PLD system.
●High resolution touch screen up to 800*600 pixel
●Multiple operation model can be set up on the touch screen to realize the desoldering and soldering automatically. Profile is protected by limits of authority.
●Perfect self protection function available. Heaters are inspected anytime in the process, when accident happen, it will alarm.
Zhuomao ZM-R6200 BGA Chip Removal Machine for Motherboard IC Repair was added in Nov 2018
Zhuomao ZM-R6200 BGA Chip Removal Machine for Motherboard IC Repair has been viewed 3325 times
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