C-Quence - Automated in-line Bonding and Soldering Solutions
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C-Quence - Automated in-line Bonding and Soldering Solutions |
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C-Quence - Automated in-line Bonding and Soldering Solutions Description:
With the C-Quence™ Nordson DIMA offers innovative automated and integrated in-line solutions for Hot Bar Reflow Soldering, Heat Seal Bonding, ACF Laminating and/or Heat Staking applications.
With Nordson DIMA's automated and integrated C-Quence™ systems you can combine and integrate several processes in an automated production cycle. Each module has it focus on a specific application process, like ACF Laminating, Product Alignement and Final Bonding, but additional options can be added to the modules to handle the parts or the products that need to be joint together, like Pick & Place tools, Flipping units to turn parts upside down, Test and inspection systems, return conveyors, etc.
What are the bonding and soldering challenges you are facing at this moment? Send an email to: info@nordsondima.com and share your ideal bonding or soldering application process cycle with us. Together we will find a solution that fits perfectly to your specific wants and needs.
Applications
- Hot Bar Reflow Soldering
- Heat-Seal Bonding
- ACF Laminating
- Heat-Staking
C-Quence - Automated in-line Bonding and Soldering Solutions was added in May 2018
C-Quence - Automated in-line Bonding and Soldering Solutions has been viewed 842 times
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