Reflow Oven with Integrated Vacuum Soldering KD-V43 for IGBT, BGA

Reflow Oven with Integrated Vacuum Soldering KD-V43 for IGBT, BGA Description:

Sunny

Company:Beijing Chengliankaida Technology Co.,Ltd

Address : SanCang Road Sanjianfang airport ,Tongzhou district , Beijing China 

Email: salemachines@bjclkdkj.cn 

Skype :smdsupplier

Whatsapp: +86 159 01434496

Wechat: + 86 159 0143 4496

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                                      Reflow Oven with Integrated Vacuum Soldering KD-V43  for IGBT, BGA

Applications:

Power Semiconductors 
  Hybrid Microelectronic Assembly  
  UHB LED´s  
  BGA  Flip Chip  
  Hermetic Seals  Optoelectro
  Optoelectronic Package 
  Wafer Level Bump 
  MEMS   
  IGBT 

Deparameters: 

Visual Monitoring Analysis System
SiemensPLC and Industrial Personal Computer
Low Vacuum :5*10ˉ¹Pa
High Vacuum : 5*10ˉ³ Pa
Welding area : 400x 300 mm
Furnace height :100mm 
Max soldering temperature : 450°C
Warm-up rate :180°C /min 
Cooling rate : ≥120℃/min  
Drawer bearing : 120KG
Heating platform :    graphite &special treatment

Standard : vacuum chamber  filling the 100% nitrogen   .
Option :  100% hydrogen, nitrogen & hydrogen forming gas , 
                HCOOH, ArH2 Plasma process gas

Oxygen-free soldering 

Improved the wetting bahavior 

Integrated or separate implementation of 
     cleaning processes for flux-free

Significant increase in yield by wider 
     process window

Rapid heating and cooling ramps , typical 3K/S

No flux residues on product level 

Flux : Formic acid type ( standred )
Monitoring window :  5 sets visual window