MARCH VIA Series Plasma Treatment
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MARCH VIA Series Plasma Treatment |
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MARCH VIA Series Plasma Treatment Description:
VIA Series plasma treatment systems offer superior plasma treatment uniformity for printed circuit board (PCB) panels.
The MaxVIA, MaxVIA-Plus, and ModVIA systems deliver various plasma cleaning, surface activation, and adhesion improvement capabilities to suit through-hole and blind VIA applications.
The VIA Series:
- High Flux Electrode (HFE) design with a temperature-controlled cooling loop delivers superior plasma treatment uniformity for PCB panel, desmear, landing pad cleaning, etchback, and flexible and rigid circuit board applications.
- Low CF4 gas consumption for desmear and etchback applications contributes to the lowest cost of ownership in their class.
- A single space-saving enclosure houses the vacuum system, plasma chamber, control electronics, and power supply.
- The systems accommodate various panel sizes and are ideal for high-volume, low-volume, and high-mixture environments.
MARCH VIA Series Plasma Treatment was added in Feb 2024
MARCH VIA Series Plasma Treatment has been viewed 16 times
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