Automatic solder paste printer GKg G9+

Automatic solder paste printer GKg G9+ Description:

G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed.

Introduction to standard functions:

1. CCD digital camera system

The brand-new light path system -- uniform ring light and high brightness coaxial light, with the function of stepless adjustment of brightness, makes all types of mark points can be well identified (including uneven mark points) and adapt to different color PCB such as tinning, copper plating, gold plating, tin spraying, FPC, etc.

2. High precision PCB thickness adjustment jack up platform

The structure is compact and reliable, the height of pin pin is adjusted automatically by software, which can accurately adjust the position and height of PCB with different thickness.

3. Guide rail positioning system

International utility model invention patents. The removable and programmable flexible side clamp device can be used to flatten the top of PCB with flexible board and warpage deformation. Through software programming, it can automatically stretch and shrink without affecting tin thickness.

4. New scraper structure design

Through the new scraper structure of slide rail and cylinder, the running stability and service life are improved.

5. High speed screen cleaning

Drip type cleaning structure can effectively prevent the local solvent free caused by plugging of solvent pipe, which may lead to unclean wiping.

6. New multifunctional interface

Simple and clear, easy to operate. Real time temperature remote control function.

Option function

1. Detection function of steel mesh

Through the light source compensation above the steel mesh, CCD is used for real-time inspection of the mesh of the steel mesh, so as to quickly detect and judge whether the steel mesh is blocked after cleaning, and carry out automatic cleaning, which is a supplement to the 2D detection of PCB board.

2. Automatic dispensing system

According to different printing process requirements, after printing, the PCB board can be accurately glued, tinned, drawn, filled and other functional operations; at the same time, the dispensing head is also equipped with a heating function, which can heat the glue when the ambient temperature is low, so as to improve the fluidity of the glue.

3. Bottle type automatic tin addition and solder paste detection function

The solder paste is added automatically at fixed time to ensure the quality of solder paste and the amount of solder paste in the steel mesh. In order to ensure the printing quality of customers and improve productivity.

Through the sensor, it can manage the amount of solder paste on the steel wire, and can carry out the quality stable and long-time continuous printing. Increase productivity.

4. SPI Online

The system is connected with SPI to form a closed-loop system. After receiving the feedback information of SPI poor printing, the machine will automatically adjust according to the SPI feedback offset. The XY direction offset can be automatically adjusted within 3pcs, and the steel mesh can be cleaned to improve the printing quality and production efficiency, thus forming a complete printing feedback system.

5. Leading industry 4.0 compatibility

6. Through the automatic upload or output of machine status and parameters, it can provide strong guarantee for the intelligent production of customer industry 4.0. It can realize seamless docking with customer MES system, and realize self assignment of engineering personnel's use rights at all levels according to site management.

G9 + specifications / G9 + technical parameters:

Substrate treatment

Maximum substrate size (XXY) 450 * 340mm

Minimum substrate size (XXY) 50 * 50mm

The thickness of base plate is 0.4 ~ 6mm

Maximum substrate weight: 3kg

The edge gap of base plate is 2.5mm

Board height: 15mm

Transmission height: 900 ± 40mm

Transmission speed: segmented control 1500mm / S (max)

One stage one-stage transport guide

Base plate clamping automatic telescopic pressing tablet

Flexible edge clip

Vacuum adsorption function

Substrate support method magnetic thimble

Contour block

Manual adjustment of lifting platform

Printing parameters

Maximum printing area (XXY) 450 * 340mm

Snap off 0-20 mm

Printing mode: single or double blade printing

Scraper type: rubber scraper / steel scraper (angle 45 / 55 / 60)

Printing speed: 10 ~ 200 mm / sec

Printing pressure: 0.5 ~ 10kg

Formwork frame size: 470 * 370mm ~ 737 * 737mm

Cleaning method: trickle cleaning system

Vacuum enhanced adsorption function

Dry, wet and vacuum modes

Wash back and forth

Image field of view: 10 * 8mm

Reference point type

Standard shape reference spot welding disc opening, custom image

Camera system

Up / down imaging vision system, digital camera, geometric matching positioning

System alignment accuracy and repeatability accuracy

±12. 5um@6 σ，CPK≥2.0

Repeat accuracy of actual solder paste printing

+ 18um@6 σ，CPK≥2.0

Printing cycle

< 7.5sec (excluding printing and cleaning time)

Power requirements

AC:220±10%,50/60HZ，3KW

Compressed air requirements

4~6 Kgf/cm2

Air consumption

About 5L / min

Working environment temperature

-20℃~+45℃

Working environment humidity

30%~60%

Machine height (remove tricolor lamp)

1530(H)mm

Machine length

1172(L)mm

Machine width

1385(W)mm

Machine weight

Approx: About 1000kg

Solder paste printing range

(1) SMT technology, such as resistors, capacitors, inductors, diodes, triodes production and processing: 0301501005, 0201, 04020603, 0805, 1206 and other specifications and sizes;

(2) , IC: support SOP, TSOP, tssop, QFN and other packages, with a minimum pitch of 0.3mm;

BGA and CSP packaging are supported, and the minimum ball diameter (ball) is 0.2mm;

(3) Printing size: 50mm x 50mm ~ 370 × 470mm;

(4) PCB specification: thickness 0.4mm ~ 6mm

(5) FPC specification: thickness less than 0.6mm (with fixture)

Scope of application

Production and manufacturing of mobile phone, communication, LCD TV, set top box, home theater, vehicle electronics, medical power equipment, aerospace and other products / equipment, and general electronic products production and processing.