Dip and Look Systems - Pulsar Solderability System

Dip and Look Systems - Pulsar Solderability System Description:

“Dip & Look Test”— The Pulsar provides precise handling of electronic components for the automated process of a flux and solder dip of the component terminations.  After the dip process, the operator inspects the terminations (i.e., “look”) for the adequate presence of solder.  If adequate, the component is validated for authenticity and solderability with the selected solder alloy. 

The Pulsar Solderability Test System (and the dual-alloy option) can flux and tin virtually any component from QFP and axial components to LCC’s and flatpacks.  The system uses a batch load method to load the component tool holders.  A flux reservoir and solder station serve to process the component leads for the dip process in flux and then solder.

The systems maintain compliance with standards as well as other applicable standards for solderability testing

ANSI-J-STD-002                  JEDEC JESD22-B102D         

ANSI-J-STD-003                  MIL-STD-202 Method 208

MIL-STD-883                       IPC/EIA J-STD 002B/C

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