BGA Rework Stencils

BGA Rework Stencils Description:

BGA Rework Stencils are now available direct to you and may be a major product improvement over what you are may be using now. FCT Assembly BGA Rework Stencils are designed to make your rework faster and cleaner. The materials used, design and precision cutting allows you to simplify the placement/replacement of area array devices such as BGAs and CSPs and other leaded SMT devices.

FCT Assembly BGA Rework flexible solder paste stencils are laser cut from high quality, anti-static polymer film (Cirlex) and come with or without a residue-free pressure sensitive adhesive (PSA) backing. The addition of PSA to our line of stencils ensures they are self-sticking and that no tape or fixturing is required. The adhesive seals around each BGA pad to prevent solder paste from bleeding under the stencil when the paste is applied and eliminates residue left on the board surface.

Typical BGA rework stencils made from metal require taping to position them and hold them in place. Metal stencils have a tendency to bend or warp and if the circuit board has undulations in the board surface, the metal stencil will not sit flat. Since there is no adhesive seal, solder paste can bleed under metal stencils when paste is applied with a squeegee.