Heraeus
We design and manufacture SMT assembly materials.
Heraeus is a family-owned, global company active in the business areas of precious metals, sensors, dental and medical products, quartz glass and specialty lighting sources. Heraeus has been one of the leading companies in precious metals and materials technology for more than 155 years.
Heraeus Postings
1 product »
As requirements are increasing, so are electronic systems becoming smaller and smaller and more complex. In its role as innovative forerunner Heraeus, the precious metals and technology company, has reacted to precisely this continuing trend to...
7 technical articles »
Troubleshooting SMT Solder Paste Problems
Mar 05, 2018 | Heraeus
Troubleshooting SMT Solder Paste Problems...
New Requirements for SIR Measurement
Feb 27, 2015 | Jörg Trodler; Heraeus Materials Technology GmbHo.KG, Mathias Nowottnick, Prof. University of Rostock.
During the last period of newly assembled electrical devices (pcbs), new component types like LGA and QFN were also qualified as well as smaller passive components with reliability requirements based on the automotive and industrial industry. In the narrow gaps under components, residues can accumulate more by the capillary forces. This is not that much a surface resistance than an interface issue. Also that the flux residues under such types of components creates interaction with the solder resists from the pcb, as well as the component body was not completely described in the standard SIR measurement. On the other hand also, electrical influence with higher voltage creates new terms and conditions, in particular the combination of power and logic in such devices. The standard SIR measurement cannot analyze those combinations.
The paper will discuss the requirements for a measurement process, and will give results. The influences of the pcb and component quality will also be discussed. Furthermore it will describe requirements for nc solder paste to increase the chemical/thermical/electrical reliability for whole devices...
Feb 08, 2013 | Richard Lathrop
Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the total void content is minimal. X-ray methods are the predominate method for solder void analysis but this method can be quite subjective for non grid array components due to the two dimensional aspects of X-ray images and software limitations. A novel method of making a copper "sandwich" to simulate under lead and under component environs during reflow has been developed and is discussed in detail. This method has enabled quantitative solder paste void analysis for lead free and specialty paste development and process refinement. Profile and paste storage effects on voiding are discussed. Additionally an optimal design and material selection from a solder void standpoint for a heat spreader on a BCC (Bumpered Chip Carrier) has been developed and is discussed....
Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications
Aug 19, 2010 | Dong Zhang, Meg Tredinnick, Mark Challingsworth
The silver end termination plays an important role for multilayer chip inductors. A basic requirement is to achieve excellent electrical properties with superior adhesion to the chip. Driven by the increasing price of silver, interest has been shown to ...
May 07, 1999 | Rick Lathrop, Heraeus SMT Technical Services
Fine pitch SMT devices, although certainly not new, present more of an assembly processing challenge than 50 mil pitch devices. In fact it seems that the finer the pitch the more difficult or narrower the process window becomes. Besides the pitch of the leads being less on fine pitch devices narrower pad width on the board is typical. With fine pitch designs the board fabrication process is also stressed in that the strip of mask between the pads is designed narrower, the alignment of the mask to copper becomes more critical...
An Introduction to Solder Materials
Apr 15, 1999 | Brian Bauer, Rick Lathrop
Solder paste is a seemingly simple material that forms one of the foundations of the surface mount assembly operation. If the solder paste does not do its job correctly then first pass yield will be severely reduced. ...
Speed Printing of SMT Adhesives
Apr 15, 1999 | Richard R. Lathrop Jr., Heraeus
High-speed printing techniques are revealed that break the speed barrier resulting from air entrapment in large apertures at fast squeegee speeds. Adhesive printability test results using conventional thickness stencils to achieve a significant range of d...
30 news releases »
Apr 08, 2024 | Heraeus, Alpha Assembly Solutions and Henkel have won in the patent infringement lawsuit against Senju Group (Senju Metal Industry Co., Ltd., Senju Metal Europe GmbH and Senju Manufacturing Europe S.R.O.) as pronounced by the District Court Frankfurt on April 3, 2024. The 1st instance judgment confirmed Senju's infringement of the patent EP 1 617 968 B1 in Germany by the M794 solder alloy material.
Heraeus Electronics Hosts ALL2GaN Event Showcasing Advances in High-Efficiency Power Electronics
Apr 03, 2024 | Heraeus Electronics is proud to announce that it will host an upcoming ALL2GaN event from April 9-10, 2024, at its facilities in Hanau. This event will focus on the groundbreaking developments in high-efficiency power electronics, particularly focusing on the capabilities of GaN chips to revolutionize the industry with higher efficiency, power density, and smaller sizes.
Don't Miss Heraeus Electronics' Award-Winning Innolot® 2.0 Solder Paste at APEX
Mar 18, 2024 | Heraeus Electronics is excited to announce its participation in the upcoming 2024 IPC APEX EXPO. The event is scheduled to take place from April 9-11, 2024 at the Anaheim Convention Center in California. Heraeus Electronics will be exhibiting in Booth 3912, showcasing its cutting-edge products, including the award-winning Microbond® SMT660 Innolot® 2.0 solder paste.
Mar 11, 2024 | Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement (JDA) to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing. The partnership combines the core competences of both companies to enable digital printing solutions for mass production in the electronics industry for the first time.
Feb 05, 2024 | Heraeus Electronics is pleased to announce the successful acquisition of the PriElex electronics inks business line from Kayaku Advanced Materials Inc. The acquisition, effective January 31, 2024, strengthens Heraeus Electronics' Thick Film business and expands its portfolio of offerings for the electronics materials industry.
Heraeus Electronics Wins 2023 GLOBAL Technology Award for Solder Alloy Innovation
Nov 20, 2023 | Heraeus Electronics is proud to announce its receipt of the prestigious 2023 GLOBAL Technology Award in the category of Solder Paste. The award highlights the contribution made by Heraeus Electronics' Microbond® SMT660 Innolot® 2.0 solder paste. The award was announced during an award ceremony that took place at productronica in Munich on Nov. 14, 2023.
Heraeus Electronics Honored by 2023 Mexico Technology Awards for New Microbond® SMT660 Series
Oct 30, 2023 | Heraeus Electronics is pleased to announce that it has been honored with a 2023 Mexico Technology Award in the category of Solder Paste – No-clean. The award recognizes Heraeus Electronics' contribution to the automotive industry with its Microbond® SMT660 Innolot® 2.0 Solder Paste. The award was announced during a ceremony that took place Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo in Mexico.
Heraeus Electronics Honored as Best Material Supplier 2022 by STMicroelectronics Bouskoura Site
Sep 13, 2023 | Heraeus Electronics has been awarded Best Material Supplier of 2022 by STMicroelectronics' Bouskoura test and assembly site. The award was presented during the annual Supplier Day held on July 20, 2023 at the site in Morocco.
Heraeus Electronics to Present Pastes for the Next Era of Mobility at SMTA International 2023
Sep 11, 2023 | Heraeus Electronics is pleased to announce its participation at SMTA International, a premier event for electronics manufacturing and assembly professionals. The event is scheduled to take place Oct. 9-12, 2023 at the Minneapolis Convention center in Minneapolis, MN. Heraeus Electronics will present its groundbreaking Microbond® SMT660 Innolot and Microbond® SMT660 Innolot® 2.0 Solder Pastes, and showcase its exceptional sinter paste innovations, including the PE338 Silver and PE401 Copper Pressure Sinter Paste in Booth #1230.
Sep 04, 2023 | Taipei city – September 2023.
