Cleaning Application:
Cleaning after die bond
Cleaning of 3D package
Micro-standoff precisely cleaning
SIP and microwave ass...
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Cleaning Equipment |
Cleaning Application
Removing all kinds of solder residues
Cleaning of micromechanical component
Removing con...
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Cleaning Equipment |
The machine is designed to perform lead cutting before and after forming. It adopts pneumatic molding press and digital display high-precision differential head to provide the best precision.&nbs...
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Components |
Pneumatic forming system adopts P-5000 pneumatic press that can perform down-pressure forming and avoid instability caused by manual press. The system includes an adjustable frame cutter and one side forming mold. It can cut lead frame and forming most of flat packaged chips for different sizes. ...
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Lead Forming |
Introduction:LRS-1 can recondition every side of leads to improve coplanarity and stan...
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Lead Forming |
Introduction:PFL can form various two-side and four-side pack chips into gull-winged shape, meets different requirements of lead forming and cutting. The equipment is cost-effective and suits for multi-varieties and small-batch production, such as research institute and military unit.
Fe...
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Lead Forming |
Introduction:Super Tinning is for THT and SMT component tinning and re-tinning applications. The system can automatically handle common and exotic components and connectors, including, but not limit...
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Components |
Introduction: Automatic forming system (APFL), adopting a precision servo-electric press and an adjustable double-side mold, can form all kinds of flat packages (top lead chip, middle lead chip and bottom lead chip). High-precision forming is achieved through adjustable parameters.
Main ...
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Lead Forming |
Cleaning application
Removing all kinds of solder residues
Cleaning of micromechanical ...
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Cleaning Equipment |
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Cleaning Equipment |
Cleaning applications
Defluxing of good or moderately soluble solder residues
Removing contamination from handling and board manufacturing
Removing FOD
Removing misprint...
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Cleaning Equipment |
Instruction:
Fixed mold forming machine PFL-FM is suitable for large batch of components such as SOP/QFP molding, can be achieved all kind of flat packaged chip(top lead ...
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Components |
Overview
Generally, the solder paste requires to be stored in cool storage (3 to 8℃). It should be recovered at room temperature (25 ± 5 ℃) for 4 hours before usage.The flux in the solder paste will react ...
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Other |