WE GOT Electronic Co., Ltd Products

SMT Products and Services offered by WE GOT Electronic Co., Ltd

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WE GOT Electronic Co., Ltd
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WE GOT Electronic Co., Ltd Products

WE GOT Electronic Co., Ltd

Thermal conductivity materials »»

Headquarters: Taipei, Taiwan

Manufacturer Other

10 listed by WE GOT Electronic Co., Ltd

Product	Category
Common type electronic automatic foot feeder DIP automatic scissors feeder Product Description: Before the industry in the DIP (traditional parts plug-in) process mostly belong to the majority of human work Procut device can replace the current DIP (traditional parts plug-in) Production costs are re...	Components
Copper Foil Composite Materia Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t...	Other
Copper Foil Composite Materia Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t...	Other
Copper Foil Composite Materia Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t...	Other
Copper Foil Composite Materia Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t...	Other
Copper Foil Composite Materia Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t...	Other
Copper Foil Composite Materia Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t...	Other
Thermally Conductive Adhesive Double Tape Product Description Thermally Conductive Adhesive Transfer Tapes 5715 is designed to provide a heat-transfer path between heat-generating components and heat sinks or other cooling devices, it can be used to seal gaps among PCBs, heat dissipating modules, metallic structures, and machi...	Other
Thermal Phase Change Pad PCH-S15 Series thermally conductive interface materialsare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal hous...	Other
Thermal pads M400 Series thermallyconductive interface materials are applied to fill the air gaps between the heatingelements and the heat dissipation fins or the metal base. Their flexibility andelasticity make them suited to the coating of the very uneven surfaces. Heatcan transmit to the metal housing o...	Other

Product

Common type electronic automatic foot feeder

DIP automatic scissors feeder Product Description: Before the industry in the DIP (traditional parts plug-in) process mostly belong to the majority of human work Procut device can replace the current DIP (traditional parts plug-in) Production costs are re...

Components

Copper Foil Composite Materia

Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t...

Other

Thermally Conductive Adhesive Double Tape

Product Description Thermally Conductive Adhesive Transfer Tapes 5715 is designed to provide a heat-transfer path between heat-generating components and heat sinks or other cooling devices, it can be used to seal gaps among PCBs, heat dissipating modules, metallic structures, and machi...

Other

Thermal Phase Change Pad

PCH-S15 Series thermally conductive interface materialsare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal hous...

Other

Thermal pads

M400 Series thermallyconductive interface materials are applied to fill the air gaps between the heatingelements and the heat dissipation fins or the metal base. Their flexibility andelasticity make them suited to the coating of the very uneven surfaces. Heatcan transmit to the metal housing o...

Other