M.O.L.E.® Reflow Oven Thermal Profilers
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M.O.L.E.® Reflow Oven Thermal Profilers |
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M.O.L.E.® Reflow Oven Thermal Profilers Description:
Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. Getting the temperature up too high or heating the assembly too quickly can result in component damage. Not heating things up enough results in poor soldering and reliability problems.
ECD manufactures a variety of instruments to assist you in accurately monitoring the time and temperature variables in your electronics manufacturing processes. This process is called Thermal Profiling.
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SuperM.O.L.E.® Gold 2 SuperM.O.L.E.® Gold 2 is a value-packed thermal profiling workhorse most often relied upon for in-transit thermal profiling work. With the world renown SuperM.O.L.E.® Gold pedigree, ECD advances the state-of-the-art with 3, 6 and 20-channel MEGA platform model choices, and 6-channels is most often specified for process development, R&D and Validation with WaveRIDER® NL 2 & OvenRIDER® NL 2. |
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SuperM.O.L.E.® Gold SuperM.O.L.E® Gold is the profiler of choice! Chosen by virtually every one of the world’s top 100 electronics manufacturing companies. Compact and very easy to use, the SuperM.O.L.E.® Gold offers enhanced 6-channel measurement with M.O.L.E.® MAP Software. |
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V-M.O.L.E.® The V-M.O.L.E.® is a full-featured compact thermal profiler that belies its sophistication in an easy-to-use 3-channel Mini-thermocouple configuration. Ideal for VERIFICATION of PCB profile performance, 3 channels give you Hot, Cold and Sensitive component data for verifying the correct oven settings. V-M.O.L.E.® also boasts the same powerful M.O.L.E.® MAP software created for the MEGAM.O.L.E.® 20 thermal profiler, including the Target-10 feature, and of course, the patented “OK-Button” |
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MEGAM.O.L.E.® 20 The MEGAM.O.L.E.® 20 Profiler offers a full 20 channels for Thermal Profiling the most of any traveling profiler in the Thermal Process industry. Do you demand the highest density of thermocouples placement possible on your Hi-Reliability, High-Value PCB? ECD's got your Spec! Do you expect a software package that flexes with your workflow, providing customizable data extractions, Imports of your .MDM M.O.L.E. libraries and compatibility with your intranet, Excel, and all ECD M.O.L.E.® profilers? The MEGAM.O.L.E.® delivers your specifications in a sleek 7.2mm thin package with patented productivity enhancing features that will give you the edge in R&D decision making to WOW Management, Customers and your OEM-EMS QA linkage. |
M.O.L.E.® Reflow Oven Thermal Profilers was added in Nov 2012
M.O.L.E.® Reflow Oven Thermal Profilers has been viewed 4381 times
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