ePaste Lead-Free Solder Paste
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ePaste Lead-Free Solder Paste |
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ePaste Lead-Free Solder Paste Description:
With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow and hand soldering as well as spheres for the attachment of area array packages.
The fluidity of SN100C is an advantage in hand soldering where, in combination with the right core flux (030), it is possible to complete more than 35 average joints per minute with a tip temperature of only 380°C.
The 227°C melting point of SN100C was first thought to preclude its use in reflow soldering. However, when it was noted that tin-silver-copper alloys (such as SAC305 with a melting point of 217°C to 218°C) are typically reflowed with a peak temperature around 245°C, it was realised that SN100C could be a replacement.
Nihon Superior now offers two types of SN100C solder paste. These are no-clean ePaste for general reflow purposes, and ePaste; a special low voiding paste for critical applications such as die attach in which heat transfer though the joint must be maximised. As an additional ePaste, SN100C is now available as a high-performance solder paste with a general purpose P500 flux medium.
ePaste Selection:
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General Purpose SN100C P500 D4(Sn-Cu-Ni+Ge)
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SN100C P500 D4 is a general purpose solder paste suitable for fine pitch applications. In most cases SN100C can be reflowed with a profile similar to that used with SAC alloys. Peak Reflow Temperature: 240oC±5oC |
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For 01005(0402 metric) Chip Components SN100C P520 D5 (Sn-Cu-Ni+Ge)
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High reliability lead-free solder paste optimized to deliver good reflow with chip components down to 0402 metric. SN100C P520 D5 improves the joint quality of densely populated boards with filletless, small solder volume chip components and fine pitch mounting in which a reduction in joint strength is a concern due to the very small joint size. Reflowed with peak 240℃±5℃ |
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Halogen-Free SN100C P602 D4(Sn-Cu-Ni+Ge)
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High Activity Halogen-Free Solder Paste SN100C (Sn-0.7Cu-0.05Ni+Ge) lead-free solder paste which does not contain halogens (F, Cl, Br, and I). No whisker observed as a result of the test that 1000 hour exposure under 85C/85% conditions. Peak Reflow Temperature: 240oC±5oC |
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Halogen-Free Dispensing Grade SN100C P603 D4(Sn-Cu-Ni+Ge)
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High reliability completely Halogen-Free Solder Paste based on Lead-Free solder alloy SN100C(Sn-0.7Cu-0.05Ni+Ge). Does not contain F, Cl, Br or I and offers superior dispensing stability that ensures no missed joints. General Purpose Paste for 0402 (1005 metric) Chip Components. Peak Reflow Temperature: 240oC±5oC |
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Halogen-Free Dispensing Grade SN100C P605 D6(Sn-Cu-Ni+Ge)
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High reliability completely Halogen-Free Solder Paste based on Lead-Free solder alloy SN100C(Sn-0.7Cu-0.05Ni+Ge). Does not contain F, Cl, Br or I and offers superior dispensing stability that ensures no missed joints. For Ｃhip Ｃomponents down to 01005 (0402 metric) Peak Reflow Temperature: 240oC±5oC |
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For Power Semiconductor SN100C P800 D2 (Sn-Cu-Ni+Ge) |
SN100C (SnCuNi+Ge) P800 D2 is a high reliability paste for device assembly that reduces voiding and reflow time. Peak Reflow Temperature: 260oC±10oC |
| For Reducing voiding SN100C P810 D4（Sn-Cu-Ni+Ge） |
SN100C P810 D4 is low-voiding lead-free solder paste. When reflowed with SN100C P810 D4 large-area solder joints such as those between power semiconductors and their substrates have a lower incidence of voiding than if reflowed with conventional lead-free solder paste. While delivering low voiding this high reliability lead-free solder paste is also formulated to deliver excellent reflow with minimum mid-chip balling and exhibits excellent wetting on all common substrates. Peak Reflow Temperture: 240℃±5℃ |
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SN96CI PF-33 FMQ(Sn-Ag-Cu)
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Sn-Ag-Cu eutectic lead-free solder for reflow soldering. Peak Reflow Temperature: 230oC~235oC |
| SN97C PF-31N FMQ(Sn-Ag-Cu) |
Stable viscosity in continuous printing. Peak Reflow Temperature: 230oC~235oC |
ePaste Lead-Free Solder Paste was added in Jan 2012
ePaste Lead-Free Solder Paste has been viewed 1083 times
