Success Circuits International Co., Ltd
professional manufacturer of pcb
|
Process Capacity
|
|
|
ITEMS
|
TECHNICAL DATA
|
|
Layers
|
2－30（layers）
|
|
Material types
|
94HB,94V0,CEM-1,CEM-3,FR4, Aluminium base, High-TG，Thick Copper，Teflon，Rogers
|
|
Biggest size
|
500mm X800mm
|
|
Outline Tolerance
|
± 0.13mm
|
|
Board Thickness
|
0.20mm--6.00mm
|
|
Thickness Tolerance ( t ≥ 0.8mm)
|
± 8%
|
|
Thickness Tolerance ( t ＜ 0.8mm)
|
± 10%
|
|
Media Thickness
|
0.075mm--5.00mm
|
|
Min Line Width
|
0.08mm
|
|
Min Space between Lines
|
0.08mm
|
|
Outter Copper Thickness
|
35um--175um
|
|
Inner Copper Thickness
|
17um--175um
|
|
Drilled Hole Size (Mechanical)
|
0.15mm--6.35mm
|
|
Finished Hole Size (Mechanical)
|
0.10mm--6.30mm
|
|
Hole Size Tolerance (Mechanical)
|
0.05mm
|
|
Hole Location Tolerance(Mechanical)
|
0.075mm
|
|
Thickness aperture ratio
|
12:01
|
|
Solderresist Type
|
Photoimagable Resist Ink
|
|
Solderresist Mask Colors
|
Green/Yellow/Red/White/Black/Blue
|
|
Min Solderresist Bridge Width
|
0.08mm
|
|
Min Solderresist Isolating Ring Deviation
|
0.05mm
|
|
Plug Hole Diameter
|
0.25mm--0.60mm
|
|
Impedance Tolerance
|
± 5%
|
|
Surface Treatment Type
|
HAL,Lead free HAL,Au(gold) Plating,Immersion Tin,Immersion Silver,Immersion Au(gold),OSP,Gold finger, Carbon Oil ,etc.
|
|
Special Requirement
|
Buried/Blind Vias+Controlled Impedance+BGA
|
|
Certificate
|
UL,IPC,SPC,ISO9000,QS9000
|
|
|
|
|
Packing Details
|
|
|
Inner Packing
|
Vaccum packing/Plastic bags
|
|
Outter Packing
|
Standard carton packing
|
|
|
|
we are a professional PCB(Printed Circuits board) manufacturer in GuangDong , china. Above is the detailed information about our process , Pls feel free to contact us if there is anything I can do for you
Contact person: larsea Ye
Email: pcbscscircuits@hotmail.com
