Fine Line Stencil, Inc.
Fine Line Stencil is committed to delivering the highest quality stencil technology in the industry.
Fine Line Stencil is a technology leading manufacture, committed to delivering the highest quality laser stencils in the industry. We use the most advanced laser and material technologies available in the world to meet current and future industry demands as components get smaller and smaller; µBGA, CSP, QFN, and 01005 components. The combination of the laser and material technology advancements coupled with our over 15 years technical expertise has resulted in our new SLIC and UltraSLIC stencils.
We serve our customers as a trusted ally, providing the loyalty of a business partner, an extension of engineering departments through our “Root Cause Analysis Service” and the economics of an outside vendor. We ensure that our customers have the highest quality products delivered on-time and pride ourselves as your value add supplier.
Fine Line Stencil, Inc. Postings
6 products »
Fine Line Stencil offers various frame systems depending on what your unique printing process requires....
Fine Line introduces our Slic™ laser cut stencil. The Slic™ material has been proven to outperform the industry standard stainless steel material. Slic™ has the mechanical and thermal properties of industry standard stainless ste...
Slic Blade™ SMT Squeegee Blades
Fine Line Stencil's unique Slic Blade™ process uses electroformed nickel to form a hard, very smooth surface with extremely low surface energy (high lubricity). Solder paste readily sticks to most metal surfaces, even coated blades, d...
Through the increase of mixed technologies, stepped stencils have gained importance to the electronic assembly manufacturer. If the solder paste quantity can no longer be adequately regulated by adjusting Step/Relief Stencil Picture the pad sizes,...
UltraSlic™ Fine Grain Stencils
Fine Line Stencil’s new UltraSlic™ FG solder paste stencil is the latest breakthrough in stencil technology. With superior paste release below surface area ratios of 0.5, UltraSlic™ FG outperforms all other existing stencil te...
NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefi...
1 technical article »
Conquering SMT Stencil Printing Challenges with Today's Miniature Components
Jun 12, 2023 | Robert F. Dervaes, Jeff Poulos, Scott Williams
The technological advancement of component and PCB technology from through-hole to surface mount (SMT) is a major factor in the miniaturization of today's electronics. Smaller and smaller component sizes and more densely packed PCBs lead to more powerful designs in much smaller product packages. With advancement, however, comes a new set of challenges in building these smaller, more complex assemblies. This is the challenge original equipment manufacturers (OEM) and contract manufacturers (CM) face today....
6 news releases »
Fine Line Stencil Announces Online Special
Sep 28, 2011 | Fine Line Stencil announces an online special for a limited time. Order Fine Line Stencil at www.FCTAssembly.com to receive a 50 percent discount on every stencil purchased.
Fine Line Stencil Aligns with Advanced Tooling Design
Dec 17, 2009 | Fine Line Stencil has teamed with Advanced Tooling Design to lead the sales efforts at its new San Jose, CA stencil facility.
Fine Line Stencil Appointed as DEK Stencil Franchisee
Nov 05, 2009 | Fine Line Stencil has been appointed as a DEK stencil franchisee, serving customers in the state of California.
Fine Line Stencil's UltraSlic FG Solder Paste Stencil Win a 2009 EMAsia Innovation Award
Apr 23, 2009 | Fine Line Stencil has been awarded a 2009 EMAsia Innovation Award in the category of Assembly Line Systems/Equipment for its UltraSlic FG solder paste stencil.
Fine Line Stencil to Premier UltraSlic FG Solder Paste Stencil at APEX 2009
Mar 18, 2009 | Fine Line Stencil will introduce the UltraSlic™ FG solder paste stencil, which sets new stencil performance standards, in booth 846 at the upcoming APEX 2009 exhibition & conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.
Fine Line Stencil to Premier New Technologies and Company Updates at APEX 2008
Mar 12, 2008 | Fine Line Stencil invites visitors to stop by booth 243 at APEX 2008 to learn about its recent positive changes in technology. The APEX exhibition and conference is scheduled to take place April 1-3, 2008 in Las Vegas.