Summary of Qualifications: |
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Control – CNC equipment to produce precision metal parts for business and industry. Computer numerical controlled equipment means that a computer defers mines the precise movement of a machine according to a software program.
During my first year at college I studied mathematics, physics, chemistry, history, literature, English.
During my second year there were special subjects : technical machines , driver for CNC machines, industrial electronics, metal cutting, bases and standards, drawing reading, computers. The practical and laboratory studies were being fulfilled. The third curse comprised specific CNC subjects: machines with CNC , automatic drivers, electrical drivers. At the end of the third curse I had been projecting speed reducer. It was necessary to draw in three dimensions a speed reducer as well as to perform calculations of the following components: gears, shafts, bodies, bearings. The main body of the project was to reduce the resistance of materials, account input and output power and handing capacity, choose material specification of different parts. During my practical studies I was being trained to work on CNC machine tools and material-feeding manipulators, cutting instruments.
My favorite subject was electrical drivers for CNC machines. Besides, I had been studying CNC software as well as ways of programming. I spend some of my practical studies at tractor unit’s production plant, where I had been performing control, measurements, having started to work by myself as CNC machine tools third discharge operator.
I participated in production of axis for bearings, which were going to be assembled in the units.
I independently loaded a program from the list of programs, performed control gauging and in case if there were divergences between too parameters, changed the program depending on an allowance.
I applied to speed cutting instruments, to which independently performed sharpening in according with a wear.
After the third course and practical studies I immigrated to Israel. From 1990-1991 I studied Hebrew.
In 1991 I entered Western –Galilee College where I studied Mathematics, Physics, Digital Electronics, Electronics communications, Microprocessors and programming, Technical English, Analog Electronics, Introduction networks, industrial electronics, introduction to inspection, theory of Electricity, theory of Measurements, Electrical components: Resisters, Capacitors, Inductors, Ohm’s Law, Serial and parallel circuits.
Digital electronics: binary number representation basic logic gates AND, OR, NOT, Karnaugh mapping for logical statement minimization, identification of static hazard conditions.
Magnetism and Electromagnetism: Conductor and Insulator, Electromagnetic induction, Capacitive and Inductive reactance, resonance, filters, complex branch and impedance.
As practical occupations: theory of electricity, microprocessors, digital electronics.
After 2 years of tutoring has defended the project on a subject: Simulation of automated teller machine. The project was grounded on 80C51 microprocessor, instead of a magnetic card the key (EEPROM) with programmable code and with the help network RS232 connection to computer served, and “money” was produced through printer.
In 1993 was called in army of a defense of Israel. After transiting course young soldier was directed on a service in Israel Air Force. In 1994 studied on course on a upkeep of planes F-16. Upon termination of course has received the diploma: mechanics of planes F-16 (Barak) also was directed for the further service on military air station where has served mechanic till 1995. The upkeep of planes was manufactured according to the instructions American Air Force (Job guide). In my duties went into: to execute direct inspection (DI) and preflight inspection (PF). Preflight inspection include of inspection before embarkation of the plane: fuel, chassis, pumps driven parts, and also common serviceability of all devices. DI - the inspection which was manufactured through a definite amount of air hours, and included thorough inspection of all mechanical systems, turbine, injectors 1,2,3 steps, and also substitution of parts concerning the requirements Job guide (packed beds, fuel pump).
In 1996 was liberated from army and was arranged to work on B.A.Electronics on a post of an assistant operator Surface Mount Technology (SMT) line. In department SMT on that moment 5 men worked. Me have acquainted in general with manufacture both variety of processes and techniques.
B.A. Electronics was established in 1985 at the Tefen Industrial Park (North Israel ) and employs about 100. B.A. Electronics is engaged in designing, manufacturing and assembling all types of electronic devices. Assembly of electronic circuit board, T.H and S.M.T., wiring of harnesses and cables, turn-key projects assembling complete devices including furnishing of components.
B.A. Electronics uses State-of-the-art sophisticated equipment, together with up-to-date technology efficient management and skilled, dedicated workers, providing highest quality work, on-time delivery and flexibility to accommodate individual customer requirements. The equipment on which I should work consist from: screen printer, conveyors, chip shooter and fine pitch, SMT oven and rework. SMT line serves for automatically assembly SMT parts and I studied varieties SMT components and packages. The first year of operation I was the schoolboy and for this year me have trained to all basic operations and processes. The process of assembly happens as follows: I receive in store room necessary for assembly components (PCB board, SMT components, stencil). Surface mount components are functionally no different from leaded components. SMCs (Surface Mount Components) are mounted on the surface of the PCB, the solder joint is all the more important as it imparts both electrical and mechanical connections unlike the through hole components where the component leads sit in the plated through holes which provide certain amount of mechanical strength when soldered. The surface mount components also see much higher temperatures during soldering. They must be designed with this requirement in mind, Because of their smaller size, it is sometimes not possible to provide part markings on them. If the devices get mixed up, they must be positively identified or thrown away. Then I begin to prepare SET-UP :
1. I load necessary SMT components on the feeders .Feeders this such device which serve for feeding SMT components in machines. Feeders are be of different aspects depending on component shipping methods are tape and reel, tube, and tray (12,16,24,32,44 mm)
2. I would receive insertion file for this purpose what to prepare the program (CircuitCAM of-line CAD converter). Training of CEO Agis Industrial Software 220 Gibraltar Road, Suite 100 Horsham PA 19044. Insertion file it file containing x, y, z parameters and ready program through network I dispatch on SMT machines.
3. I adjust SMT line. On B.A.Electronics is 2 SMT Line. First line consists from: screen printer (of-line), conveyer, chip shutter, fine pitch shutter conveyer, reflow oven, magazines.
3.1 Screen printer - SMTech 100mv high precision The 100MV uses production- proven 100 series technology and has a modular upgrading capability. It is fitted with sophisticated menu-driven control software for fast set-up and ease of use. The tooling system is SMEMA compliant and will accommodate the heavily populated, double sided PCB’s. For customization it is necessary to me to select stencil which will match PCB board and to fix it(him) on screen printer. Then I adjust: limit position, speed and pressure, PCB board position. Then I render solder paste on the stencil, I adjust fiducially point on PCB board and printed solder paste on PCB board.
3.2 Chip shutters - Contact 3AV, fine pitch shutter - Contact Z The Contact 3Z is the latest in the 3 Series of SMT placement machines. The 3Z places a full range of component types from small chip resistors and capacitors, to large, leaded integrated circuits, including ultra fine pitch devices and BGA’s. It features a vision and positioning system with the extreme accuracy required for ultra fine pitch placements, and the speed for high volume production. I establish (mount) feeders with SMT components to chip shutter and I adjust PCB board (load program and fixed fiducially points). Training of Contact 3AV, Z we manufacture Contact systems in USA (Contact Systems, Miry Brook Road, Danbury, Connecticut 06810 ).
3.3 Reflow oven - Heller 1088 forced convection reflow exemplifies our advanced engineering capabilities with innovations that meet or exceed the most demanding process and quality requirements of medium volume electronics assemblers. Heller 1088 consists from 4 heating zone forced convection reflow system with 4 haters above and below the conveyor. Depending on PCB board I adjust necessary temperature in each of zone concerning temperature given by the supplier solder paste.
3.4 Temperature in reflow oven I check by a gear Super M.O.L.E. Temperature Profiler. The Mole is a small battery powered temperature recording device that is designed to provide a great deal of sophisticated time and temperature information. M.O.L.E. stands for Multichannel Occurrent Logger Evaluator. Process of assembly as follows: with the help screen printer on PCB I render solder paste and I guide him on conveyer in chip shutter on which are going small chip resistors and capacitors. After that fractionally collected PCB crosses on conveyer on Fine pitch shutter where are going remaining components (fine pitch, BGA’s, leaded integrated circuits), further completely collected PCB passes visible inspection and hits in reflow oven where under an operation of temperature solder past melt and turns in normal solder. After that ready PCB passes visible inspection with the help digital microscope. Visible inspection I manufacture on the international standard IPC-610 on which has received license in Israel. The IPC-A-610C is the most widely used publication dealing with the acceptability of printed board assemblies throughout the world. It illustrates industry accepted workmanship standards and is a visual guide that provides clear representation of electronic manufacturing acceptability criteria, based on the consensus of industry experts.
4. Second Line consists from: loader, screen printer (in-line), chip, fine pitch and BGA shutter, conveyer, reflow oven, unloader.
4.1 Loader: accommodating in which I load magazine with PCB board and which gives PCB in screen printer.
4.2 Screen printer (in-line): SMTech AVX400 Fully Automatic In-line High Precision Screen Printer The SMTech AVX400, designed around the 23 “standard screen frame format, is fully featured for true hands-off automated operation. It offers a Windows based user interface and a whole host of options which along with its single roving camera makes this an excellent all-round performer. Screen printer (in-line): DEK Horizon 03i delivers the outstanding Horizon blend of performance and value – with interest. The benefits of revolutionary Instinctive user interface features, the new Optimized Printer Frame for maximum mechanical and thermal stability, and the new ISCAN Intelligent Scalable Control Area Network that replaces the traditional wiring loom with a faster, lighter and more reliable bus system supporting advanced features.
4.3 Chip, fine pitch, BGA shutter: I-Pulse M2 .T The Model M2 SMD placement system, the successor of the innovative i-pulse M1 model, utilizes high-speed on-the-fly vision component inspection and recognition system capable of imaging and precisely positioning virtually any Surface Mount Device. With the proven ability to place 0201, 0.3mm QFP, µBGA, BGA, CSP, Connectors, and odd-form SMDs, including all common SMT components.
4.4 Reflow oven: Heller1700 embodies the most advanced designs for forced convection SMT reflow and curing ovens (7 hearting zone).
4.5 Unloader: accommodating for stacking collected PCB.
The process of assembly happens just as on the first line (Contact) only completely automatically, as PCB moves with the help loader in in-line screen printer and at the end of a cycle go out from reflow oven in loader. I also able to provide a full BGA and Micro BGA rework / re-balling service using a combination of dedicated BGA rework equipment in conjunction with in house EXERA X-Ray inspection. A built up an expertise in BGA rework for a number of clients both small and medium volume and currently use the latest BGA rework equipment EXERA: X-ray inspection is recognized as a vital step in the test regime of the PCB and semiconductor industries. Fault finding on current package designs is extremely demanding so X-ray systems must provide, as a minimum, high resolution, high magnification and high contrast X-ray images, at the largest and different angular views. Fast inspection throughput and user-friendliness are also essential when specifying an X-ray system. I work by all machines and on all sites of assembly, and also maintenance of all machines : CONTACT AV, Z machines, I-Pulse (Yamaha) machines, DEK and SMTech machines. The course has passed and is acquainted with production lead free. Manufactured inspections on solder past, PCB and components. lead free materials and technologies, mix technologies, these new technologies should provide product integrity, performance and reliability equivalent to lead-containing products without introducing new environmental risks or health hazards. IPC prefers global rather than regional solutions to this issue, and is encouraging a coordinated approach to the voluntary reduction or elimination of lead by the electronic interconnection industry.
I am engaged in inspections on automated test equipment (ICT test). YP-1024 Low voltage cable and harness tester (Up to 5V), The YP-1024 also diagnoses shorts, opens, malfunctions and mis-wires in any cable. Although ideal for use in the automotive industry, this tester is suitable for all low voltage testing purposes. I conduct different inspections with measuring instruments by such as: DVM, oscilloscope , pulse generator, power supply.
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