Summary of Qualifications: |
Working Experience:
Fairchild Semiconductor, South Portland, ME
Package Simulation Co-op: Technology CAD Group (Mar.2002-Present)
Thermal simulation for 40 lead fine pitch QSOP & 48 lead one die fine pitch QSOP:
Created a 3D model of IC Package using ANSYS and performed thermal simulation
to determine thermal resistance by simulating the heat transfer and temperature
distribution in package placed on test board.
Thermal simulation for Fine Pitch Ball Grid Array (FPBGA) Package family:
Working on simulating the behavior of BGA packages to guide and verify the
designs and to reduce design cycle time by geometric idealization that
are significant for thermal analysis of BGA package.
Failure Analysis of the IC Package:
Recommended the mode of failure for a surface mountable IC package to
the Package Development Technology Group and identified the reasons for the failure mode.
Rochester Institute of Technology, Rochester, NY
Graduate Assistant: Surface Mount Technology (SMT) Lab.(Aug.2001-Mar2002)
Worked on International Stencil Consortium Project to find �Optimal print process
parameters for fine- pitch assemblies�. Project involves programming of
fully automatic stencil printer (DEK 265 Horizon) and 3-D solder paste
inspection system (SVS 8200 SPI) with Quality Assurance and Data Analysis.
Graduate Assistant: Surface Mount Technology (SMT) Lab.(Jun.2001-Aug. 2001)
Successfully completed a Jet Propulsion Laboratory�s Project
�Study impact of print parameters and I/O on solder paste quality and volume�.
Which involved strong application of Data Analysis and Design of Experiments.
Graduate Assistant: Computer Integrated Manufacturing (CIM) Lab.(Dec.2000- May2001)
Developed distance-learning website course on Controls for Manufacturing & Automation
by using dreamweaver, FrontPage2000 and Java Script
Graduate Assistant: Mechanical Engineering (Sep2000-Dec2000)
Conducted literature survey in development of particulate matter measurement to
build an engine testing facility
Indian Institute of Technology (IIT), Bombay
Research Assistant: Mechanical Engineering Department (Feb.2000-June2000)
Worked on Limit Load Analysis of 500Mwe PHT Elbows with Surface Flaws.
Modeled pipe joint using NISA software.
Relevant Graduate Courses
Robust Design
ComputerImplementation of FEA (ANSYS)
Design for Manufacture
Computer Aided Engineering (I-DEAS)
Design of Experiments
Electronics Packaging
Project Management
Database Management and Communication
Graduate Projects
Analysis of thermal stresses in a Turbine blade using ANSYS:
The project involved modeling and finite element analysis of turbine with
application of indirect coupling. The results recommended for selecting turbine blade
material with higher thermal conductivity value.
Finite Element Analysis of Connecting Rod using I-DEAS:
Created solid model and performed finite element analysis to evaluate multiple design
concepts, which affect the material & manufacturing cost and submitted the final product that satisfied the customer�s requirement.
Design of Experiment on Adhesive Dispensing Machine for Surface Mount Assembly:
The project paper deals with the statistical analysis of the adhesive Heraeus PD955 data
using Minitab software. The results were analyzed to find out the best
combinations of the various factors to dispense best possible adhesive dot.
Finite element analysis of Axisymmetric nozzle using I-DEAS:
Created 3D solid model and performed finite element analysis to evaluate
the multiple design concepts.
Awards
Recipient of the Donald Boyce scholarship for academic Excellence in the field of Manufacturing Engineering.
Keywords
ANSYS, I-DEAS, SMT, DFM&DFA, PLC, Electronics Packaging, DOE, Taguchi, Labview
References
Available upon request.
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