Date Posted: |
February 6, 2014 |
Job Category: |
Engineering |
Location: |
Seymour, Connecticut, USA |
Job Description: |
Develop and manage SMT assembly and soldering processes and associated staff in medium volume/high-mix printed circuit board assembly operation for complex quality class 2/3 assemblies.
DUTIES AND RESPONSIBILITIES:
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Plan and develop processes and capacity utilization strategy for SMT assembly operation. (Kitting, solder paste printing, automated solder paste inspection, component placement, reflow soldering, automated optical inspection, automated X-ray inspection, 2D and 3D.)
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Identify and solve production/quality issues.
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Ensure production readiness of key processes in PCB assembly cycle.
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Design experiments to develop optimum production processes. (Solder paste selection, stencil designs, feeder setup methodology, selective soldering techniques etc.)
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Optimize machine setup and programming sequences.
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Trouble-shoot to root-cause equipment and process related problems.
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Write pre and post build DFM reports in customer centric manner.
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Manipulate data files to accomplish above (Gerber, ODB++, various CAD packages and 3D modeling; i.e. Solidworks.)
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Develop appropriate secondary manufacturing processing processes: rework processes, hot air, BGA repair.
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Monitor and manage PCA cleaning processes.
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