Packaging Engineer
Date Posted: |
November 8, 2006 |
Job Category: |
Engineering Production Research and Development Technical Support |
Company Division: |
Standard Linear Logic |
Location: |
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Job Description: |
SMT Packaging Engineer:
Location: Texas - Sherman , TX
Group: HVAL
Degree Requirements: BS ME/ChemE/Materials
The person in this position will have the ability to make very significant financial contributions to TI because this is a very critical role in our business.
In this role, you'll provide support to customers with Wafer Level and Ball Grid Array packages. Specific responsibilities include:
- Support marketing with Surface Mount Application Guidelines, technical support during customer visits, and technical promotional material (application guidelines, design guidelines).
- Provide packaging and Surface Mount Technology (SMT) application support for all package-related issues at customer sites worldwide.
- Develop new package technologies in support of HVAL business organizations.
- Support SMT guideline generation for HVAL pin / packages (BGA, QFN, WCSP, PowerPad and Leadframe base packages).
- Generate PCB layout, land patterns, stencil design drawings, solder paste, and reflow profile selections.
- Provide customer support with all board assembly related issues (PCB design, equipment capability, pick up tools, rework process, hand testing).
- Generate design guides and application notes for various packages.
- Train and educate customers as well as the TI sales force on issues related to advanced packages.
- Address all quality, information, data, and training requests coming from customers and field sales.
This engineer must be up-to-date on industry standards and be willing and able to travel domestically and overseas. 5+ years of related experience is needed. Additional language skills (Chinese, Japanese, and Korean) are a plus. Prior experience writing application notes and design guides is also needed.
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